PA0006C Chip Quik
Виробник: Chip Quik
PCBs & Breadboards SOIC-16 to DIP-16 SMT Adapter (1.27 mm pitch, 600 mil body) Compact Series
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Технічний опис PA0006C Chip Quik
Description: SOIC-16 TO DIP-16 SMT ADAPTER (1, Packaging: Bulk, Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC, Part Status: Active.
Інші пропозиції PA0006C
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
PA0006C | Chip Quik Inc. |
Description: SOIC-16 TO DIP-16 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| PA0006C |
|
Виробник: Chip Quik Inc.
Description: SOIC-16 TO DIP-16 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-16 TO DIP-16 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.