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Технічний опис PA0074 Chip Quik
Description: QFN-56 TO DIP-56 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm), Material: FR4 Epoxy Glass, Number of Positions: 56, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: QFN, Part Status: Active.
Інші пропозиції PA0074
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
PA0074 | Chip Quik Inc. |
 Description: QFN-56 TO DIP-56 SMT ADAPTERPackaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| PA0074 |
|
Виробник: Chip Quik Inc.
Description: QFN-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.