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Технічний опис PA0103 Chip Quik
Description: LGA-16 TO DIP-16 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm), Material: FR4 Epoxy Glass, Number of Positions: 16, Pitch: 0.020" (0.50mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: LGA, Part Status: Active.
Інші пропозиції PA0103
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
PA0103 | Chip Quik Inc. |
 Description: LGA-16 TO DIP-16 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| PA0103 |
|
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.