PE-65301NLT Pulse Electronics
Виробник: Pulse Electronics
Description: XFMR FWD P-P DC/DC CONV TH
Packaging: Tape & Reel (TR)
Size / Dimension: 1.050" L x 1.150" W (26.67mm x 29.21mm)
Mounting Type: Through Hole
Type: For DC/DC Converters
Operating Temperature: -30°C ~ 130°C
Applications: Forward, Push-Pull Converters
Voltage - Isolation: 600Vrms
Intended Chipset: LM1577, LM2577
Footprint: 1.050" L x 1.150" W (26.27mm x 29.21mm)
Chipset Manufacturer: National Semiconductor
Height - Seated (Max): 0.810" (20.57mm)
Part Status: Active
Description: XFMR FWD P-P DC/DC CONV TH
Packaging: Tape & Reel (TR)
Size / Dimension: 1.050" L x 1.150" W (26.67mm x 29.21mm)
Mounting Type: Through Hole
Type: For DC/DC Converters
Operating Temperature: -30°C ~ 130°C
Applications: Forward, Push-Pull Converters
Voltage - Isolation: 600Vrms
Intended Chipset: LM1577, LM2577
Footprint: 1.050" L x 1.150" W (26.27mm x 29.21mm)
Chipset Manufacturer: National Semiconductor
Height - Seated (Max): 0.810" (20.57mm)
Part Status: Active
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Технічний опис PE-65301NLT Pulse Electronics
Description: XFMR FWD P-P DC/DC CONV TH, Packaging: Tape & Reel (TR), Size / Dimension: 1.050" L x 1.150" W (26.67mm x 29.21mm), Mounting Type: Through Hole, Type: For DC/DC Converters, Operating Temperature: -30°C ~ 130°C, Applications: Forward, Push-Pull Converters, Voltage - Isolation: 600Vrms, Intended Chipset: LM1577, LM2577, Footprint: 1.050" L x 1.150" W (26.27mm x 29.21mm), Chipset Manufacturer: National Semiconductor, Height - Seated (Max): 0.810" (20.57mm), Part Status: Active.