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Q3-0.005-AC-108 Bergquist

BERGQUIST-SIL-PAD-TSP-Q3000-en_GL.pdf
Виробник: Bergquist
Description: THERM PAD 116.84MMX60.96MM W/ADH
Backing, Carrier: Fiberglass
Adhesive: Adhesive - One Side
Thermal Conductivity: 2.0W/m-K
Outline: 116.84mm x 60.96mm
Usage: Power Module
Thermal Resistivity: 0.35°C/W
Type: Pad, Sheet
Thickness: 0.0050" (0.127mm)
Shape: Rectangular
Material: Elastomer
Color: Black
Packaging: Bulk
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Технічний опис Q3-0.005-AC-108 Bergquist

Description: THERM PAD 116.84MMX60.96MM W/ADH, Backing, Carrier: Fiberglass, Adhesive: Adhesive - One Side, Thermal Conductivity: 2.0W/m-K, Outline: 116.84mm x 60.96mm, Usage: Power Module, Thermal Resistivity: 0.35°C/W, Type: Pad, Sheet, Thickness: 0.0050" (0.127mm), Shape: Rectangular, Material: Elastomer, Color: Black, Packaging: Bulk.