Продукція > BERGQUIST > Q3-0.005-AC-18

Q3-0.005-AC-18 Bergquist

BERGQUIST%20SIL%20PAD%20TSP%20Q2000-EN?pid=BERGQUIST%20SIL%20PAD%20TSP%20Q2000&format=MTR&subformat=HYS&language=EN&plant=WERCS

Виробник: Bergquist
Description: THERM PAD 39.7X26.67MM W/ADH
Packaging: Bulk
Color: Black
Material: Elastomer
Shape: Rhombus
Thickness: 0.0050" (0.127mm)
Type: Pad, Sheet
Thermal Resistivity: 0.35°C/W
Usage: TO-3
Outline: 39.70mm x 26.67mm
Thermal Conductivity: 2.0W/m-K
Adhesive: Adhesive - One Side
Backing, Carrier: Fiberglass
Part Status: Active

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Технічний опис Q3-0.005-AC-18 Bergquist

Description: THERM PAD 39.7X26.67MM W/ADH, Packaging: Bulk, Color: Black, Material: Elastomer, Shape: Rhombus, Thickness: 0.0050" (0.127mm), Type: Pad, Sheet, Thermal Resistivity: 0.35°C/W, Usage: TO-3, Outline: 39.70mm x 26.67mm, Thermal Conductivity: 2.0W/m-K, Adhesive: Adhesive - One Side, Backing, Carrier: Fiberglass, Part Status: Active.