QMS-032-01-SL-D-DP-RA-MG Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY PLG 64P R/A GOLD
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.320" (8.12mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 64
Mounting Type: Surface Mount, Right Angle; Through Hole
Contact Finish: Gold
Connector Type: Differential Pair Array, Male
Features: Ground Bus (Plane), Mating Guide
Packaging: Tray
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Технічний опис QMS-032-01-SL-D-DP-RA-MG Samtec Inc.
Description: CONN DIFF ARRAY PLG 64P R/A GOLD, Number of Rows: 2, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.320" (8.12mm), Pitch: 0.025" (0.64mm), Number of Positions: 64, Mounting Type: Surface Mount, Right Angle; Through Hole, Contact Finish: Gold, Connector Type: Differential Pair Array, Male, Features: Ground Bus (Plane), Mating Guide, Packaging: Tray.
Інші пропозиції QMS-032-01-SL-D-DP-RA-MG
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
QMS-032-01-SL-D-DP-RA-MG | Samtec | Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip |
товару немає в наявності |
В кошику од. на суму грн. |
| QMS-032-01-SL-D-DP-RA-MG |
Виробник: Samtec
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip
товару немає в наявності
В кошику
од. на суму грн.