QSS-032-01-F-D-DP-LS2 Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Packaging: Tray
Features: Ground Bus (Plane), Mating Flange
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 64
Pitch: 0.025" (0.64mm)
Height Above Board: 0.143" (3.63mm)
Contact Finish Thickness: 3.00µin (0.076µm)
Mated Stacking Heights: 5mm
Part Status: Active
Number of Rows: 2
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Packaging: Tray
Features: Ground Bus (Plane), Mating Flange
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 64
Pitch: 0.025" (0.64mm)
Height Above Board: 0.143" (3.63mm)
Contact Finish Thickness: 3.00µin (0.076µm)
Mated Stacking Heights: 5mm
Part Status: Active
Number of Rows: 2
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Технічний опис QSS-032-01-F-D-DP-LS2 Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Packaging: Tray, Features: Ground Bus (Plane), Mating Flange, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 64, Pitch: 0.025" (0.64mm), Height Above Board: 0.143" (3.63mm), Contact Finish Thickness: 3.00µin (0.076µm), Mated Stacking Heights: 5mm, Part Status: Active, Number of Rows: 2.