QTE-028-08-H-D-DP Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY PLG 56P SMD GOLD
Packaging: Bulk
Features: Ground Bus (Plane)
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Height Above Board: 1.151" (29.24mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
Description: CONN DIFF ARRAY PLG 56P SMD GOLD
Packaging: Bulk
Features: Ground Bus (Plane)
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Height Above Board: 1.151" (29.24mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
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Технічний опис QTE-028-08-H-D-DP Samtec Inc.
Description: CONN DIFF ARRAY PLG 56P SMD GOLD, Packaging: Bulk, Features: Ground Bus (Plane), Connector Type: Differential Pair Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 56, Pitch: 0.031" (0.80mm), Height Above Board: 1.151" (29.24mm), Contact Finish Thickness: 30.0µin (0.76µm), Number of Rows: 2.