R5F56609AGFB#30

R5F56609AGFB#30 Renesas Electronics America Inc



Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RX660 1M 5V LFQFP144 T
Number of I/O: 133
Part Status: Active
Supplier Device Package: 144-LFQFP (20x20)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: RXv3
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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Технічний опис R5F56609AGFB#30 Renesas Electronics America Inc

Description: 32BIT MCU RX660 1M 5V LFQFP144 T, Number of I/O: 133, Part Status: Active, Supplier Device Package: 144-LFQFP (20x20), Peripherals: DMA, LVD, POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Core Size: 32-Bit, Data Converters: A/D 24x12b; D/A 2x12b, Core Processor: RXv3, EEPROM Size: 32K x 8, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 128K x 8, Program Memory Size: 1MB (1M x 8), Speed: 120MHz, Mounting Type: Surface Mount, Package / Case: 144-LQFP, Packaging: Tray.