R7F701373AEABG-C#BC1 Renesas Electronics Corporation
Виробник: Renesas Electronics Corporation
Description: IC MCU 32BIT
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 292-FBGA (17x17)
Peripherals: DMA, POR, PWM, Temp Sensor, WDT
Connectivity: CANbus, CSI, Ethernet, FIFO, FlexRay, LINbus, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 24x12b SAR
Core Processor: RH850G3M
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C
RAM Size: 448K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 292-FBGA
| Кількість | Ціна |
|---|---|
| 1+ | 2331.85 грн |
| 10+ | 1816.84 грн |
| 25+ | 1709.95 грн |
| 100+ | 1494.45 грн |
| 250+ | 1441.89 грн |
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Технічний опис R7F701373AEABG-C#BC1 Renesas Electronics Corporation
Description: IC MCU 32BIT, Packaging: Tray, Qualification: AEC-Q100, Grade: Automotive, Supplier Device Package: 292-FBGA (17x17), Peripherals: DMA, POR, PWM, Temp Sensor, WDT, Connectivity: CANbus, CSI, Ethernet, FIFO, FlexRay, LINbus, SENT, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 24x12b SAR, Core Processor: RH850G3M, EEPROM Size: 64K x 8, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 150°C, RAM Size: 448K x 8, Program Memory Size: 2MB (2M x 8), Speed: 240MHz, Mounting Type: Surface Mount, Package / Case: 292-FBGA.
Інші пропозиції R7F701373AEABG-C#BC1
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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R7F701373AEABG-C#BC1 | Виробник : Renesas Electronics |
32-bit Microcontrollers - MCU 32BIT MCU RH850/P1X-C |
товару немає в наявності |