R7F701428EABG-C#BC1 Renesas Electronics Corporation
Виробник: Renesas Electronics Corporation
Description: IC MCU 32BIT 3.75MB FLASH 376BGA
Supplier Device Package: 376-BGA (23x23)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b
Core Processor: RH850G3M
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TJ)
RAM Size: 3.6M x 8
Program Memory Size: 3.75MB (3.75M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 376-BGA
Packaging: Tray
| Кількість | Ціна |
|---|---|
| 1+ | 2408.53 грн |
| 10+ | 1891.39 грн |
| 25+ | 1819.45 грн |
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Технічний опис R7F701428EABG-C#BC1 Renesas Electronics Corporation
Description: IC MCU 32BIT 3.75MB FLASH 376BGA, Supplier Device Package: 376-BGA (23x23), Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Core Size: 32-Bit, Data Converters: A/D 16x12b, Core Processor: RH850G3M, EEPROM Size: 64K x 8, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 150°C (TJ), RAM Size: 3.6M x 8, Program Memory Size: 3.75MB (3.75M x 8), Speed: 240MHz, Mounting Type: Surface Mount, Package / Case: 376-BGA, Packaging: Tray.