R7F7017103ABG-C#BC1 Renesas Electronics America Inc

Description: 32BIT MCU RH850/F1KH 6MB, Number of I/O: 174, Part Status: Active, Supplier Device Package: 233-FBGA (15x15), Peripherals: DMA, PWM, WDT, Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 38x10b, 32x12b, Core Processor: RH850G3KH, EEPROM Size: 256K x 8, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 896K x 8, Program Memory Size: 6MB (6M x 8), Speed: 240MHz, Mounting Type: Surface Mount, Package / Case: 233-FBGA, Packaging: Tray.