R7FA4M3AF2CBM#BC0 Renesas Electronics Corporation

Description: MCU:RA, Packaging: Tray, Package / Case: 144-LFBGA, Mounting Type: Surface Mount, Speed: 100MHz, Program Memory Size: 1MB (1M x 8), RAM Size: 128K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 8K x 8, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 22x12b SAR; D/A 2x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V, Connectivity: CANbus, I2C, MMC/SD, QSPI, Serial Sound, SCI, SPI, UART/USART, USB, Peripherals: Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT, Supplier Device Package: 144-LFBGA (7x7), Part Status: Active, Number of I/O: 109.