R9A06G064SGBG#BC0 Renesas Electronics Corporation

Description: SOC R-IN CL3 CC-LINK IE TSN, Connectivity: CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 1.09V ~ 1.21V, 2.375V ~ 2.625V, 3.135V ~ 3.465V, Number of I/O: 101, Part Status: Active, Supplier Device Package: 356-FBGA (17x17), Peripherals: DMA, PWM, WDT, Core Size: 32-Bit, Core Processor: ARM® Cortex®-M4F, Program Memory Type: RAM, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 512K x 8, Program Memory Size: 768KB (768K x 8), Speed: 100MHz, Mounting Type: Surface Mount, Package / Case: 356-FBGA, Packaging: Tray.