RASWLF.031 8OZ Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Flux Type: Rosin Activated (RA)
Process: Lead Free
Form: Spool, 8 oz (227g), 1/2 lb
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 21 AWG, 20 SWG
Diameter: 0.031" (0.79mm)
Packaging: Bulk
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Технічний опис RASWLF.031 8OZ Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI, Flux Type: Rosin Activated (RA), Process: Lead Free, Form: Spool, 8 oz (227g), 1/2 lb, Melting Point: 422 ~ 428°F (217 ~ 220°C), Type: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Wire Gauge: 21 AWG, 20 SWG, Diameter: 0.031" (0.79mm), Packaging: Bulk.

