S1C17F63F101100 Epson Electronics America Inc-Semiconductor Div
Виробник: Epson Electronics America Inc-Semiconductor DivDescription: IC MCU 16BIT 32KB FLASH 100QFP15
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 16.8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S1C17
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 100-QFP15 (14x14)
Number of I/O: 17
DigiKey Programmable: Not Verified
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Технічний опис S1C17F63F101100 Epson Electronics America Inc-Semiconductor Div
Description: IC MCU 16BIT 32KB FLASH 100QFP15, Packaging: Tray, Package / Case: 100-LQFP, Mounting Type: Surface Mount, Speed: 16.8MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 2K x 8, Operating Temperature: -40°C ~ 85°C, Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 256 x 8, Core Processor: S1C17, Data Converters: A/D 7x12b SAR, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V, Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT, Supplier Device Package: 100-QFP15 (14x14), Number of I/O: 17, DigiKey Programmable: Not Verified.