S1C17M22F001100 Epson Electronics America Inc-Semiconductor Div

Description: IC MCU 16BIT 16KB FLASH 48TQFP12
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 21MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: S1C17
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 48-TQFP12 (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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Технічний опис S1C17M22F001100 Epson Electronics America Inc-Semiconductor Div
Description: IC MCU 16BIT 16KB FLASH 48TQFP12, Packaging: Tray, Package / Case: 48-TQFP, Mounting Type: Surface Mount, Speed: 21MHz, Program Memory Size: 16KB (16K x 8), RAM Size: 2K x 8, Operating Temperature: -40°C ~ 85°C, Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: S1C17, Data Converters: A/D 8x12b SAR, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V, Connectivity: I2C, IrDA, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT, Supplier Device Package: 48-TQFP12 (7x7), Number of I/O: 39, DigiKey Programmable: Not Verified.