S32G234MSBK1VUCR NXP USA Inc.
Виробник: NXP USA Inc.Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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Технічний опис S32G234MSBK1VUCR NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR, Packaging: Tape & Reel (TR), Package / Case: 525-FBGA, FCBGA, Mounting Type: Surface Mount, Speed: 400MHz, Operating Temperature: -40°C ~ 105°C (TA), Core Processor: ARM® Cortex®-M7, Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V, Supplier Device Package: 525-FCPBGA (19x19), Ethernet: 1/2.5Gbps (4), Number of Cores/Bus Width: 3 Core, 32/64-Bit, Co-Processors/DSP: Multimedia; NEON, Graphics Acceleration: No, Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC, Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART, Grade: Automotive, Qualification: AEC-Q100.