S32K324EHT1VPBSR NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC
Qualification: AEC-Q100
Number of I/O: 142
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tape & Reel (TR)
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Технічний опис S32K324EHT1VPBSR NXP USA Inc.
Description: IC, Qualification: AEC-Q100, Number of I/O: 142, Grade: Automotive, Supplier Device Package: 172-QFP (16x16), Peripherals: DMA, I2S, WDT, Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 24x12b SAR, Core Processor: ARM® Cortex®-M7F, EEPROM Size: 128K x 8, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 512K x 8, Program Memory Size: 4MB (4M x 8), Speed: 160MHz, Mounting Type: Surface Mount, Package / Case: 172-QFP, Packaging: Tape & Reel (TR).