S32M241LCABMKHSR NXP USA Inc.
Виробник: NXP USA Inc.
Description: S32M241LCABMKHSR
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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Технічний опис S32M241LCABMKHSR NXP USA Inc.
Description: S32M241LCABMKHSR, Qualification: AEC-Q100, Grade: Automotive, Supplier Device Package: 64-LQFP (10x10), Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT, Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V, Core Size: 32-Bit, Data Converters: A/D 6x12b SAR; D/A 1x8b, Core Processor: ARM® Cortex®-M4F, EEPROM Size: 64K x 8, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 125°C (TA), RAM Size: 32K x 8, Program Memory Size: 128KB (128K x 8), Speed: 80MHz, Mounting Type: Surface Mount, Package / Case: 64-LQFP Exposed Pad, Packaging: Tape & Reel (TR).