SEAMP-20-02.0-L-06-GP Samtec Inc.
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Number of Rows: 6
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.181" (4.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 120
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Features: Board Guide
Packaging: Tube
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Технічний опис SEAMP-20-02.0-L-06-GP Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN, Number of Rows: 6, Mated Stacking Heights: 7mm, 8mm, 8.5mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.181" (4.60mm), Pitch: 0.050" (1.27mm), Number of Positions: 120, Mounting Type: Through Hole, Contact Finish: Gold, Connector Type: High Density Array, Male, Features: Board Guide, Packaging: Tube.
Інші пропозиції SEAMP-20-02.0-L-06-GP
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
SEAMP-20-02.0-L-06-GP | Samtec |
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal |
товару немає в наявності |
В кошику од. на суму грн. |
| SEAMP-20-02.0-L-06-GP |
|
Виробник: Samtec
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
товару немає в наявності
В кошику
од. на суму грн.