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SEAMP-20-02.0-S-06-GP Samtec Inc.

SEAMP-20-02.0-S-06-GP
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.181" (4.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 120
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Features: Board Guide
Packaging: Bulk
Number of Rows: 6
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Технічний опис SEAMP-20-02.0-S-06-GP Samtec Inc.

Description: .050" SEARAY HIGH-SPEED HIGH-DEN, Mated Stacking Heights: 7mm, 8mm, 8.5mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.181" (4.60mm), Pitch: 0.050" (1.27mm), Number of Positions: 120, Mounting Type: Through Hole, Contact Finish: Gold, Connector Type: High Density Array, Male, Features: Board Guide, Packaging: Bulk, Number of Rows: 6.