SI485 ALUTRONIC
Виробник: ALUTRONIC
Category: Heatsinks - equipment
Description: Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV
Type of heat transfer pad: silicone
Application: SOT32
Thickness: 0.18mm
Thermal conductivity: 0.9W/mK
Operating temperature: -60...200°C
Dielectric strength: 4kV
Dimensions: 7.9x11.1mm
Material: glass fiber reinforced silicone
Mounting: screw
Category: Heatsinks - equipment
Description: Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV
Type of heat transfer pad: silicone
Application: SOT32
Thickness: 0.18mm
Thermal conductivity: 0.9W/mK
Operating temperature: -60...200°C
Dielectric strength: 4kV
Dimensions: 7.9x11.1mm
Material: glass fiber reinforced silicone
Mounting: screw
на замовлення 97 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 190.71 грн |
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Технічний опис SI485 ALUTRONIC
Category: Heatsinks - equipment, Description: Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV, Type of heat transfer pad: silicone, Application: SOT32, Thickness: 0.18mm, Thermal conductivity: 0.9W/mK, Operating temperature: -60...200°C, Dielectric strength: 4kV, Dimensions: 7.9x11.1mm, Material: glass fiber reinforced silicone, Mounting: screw.