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SIL08M223J

SIL08M223J TE Connectivity Passive Product

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Виробник: TE Connectivity Passive Product
Description: RES ARRAY 4 RES 22K OHM 8SIP
Operating Temperature: -55°C ~ 125°C
Mounting Type: Through Hole
Size / Dimension: 0.800" L x 0.098" W (20.32mm x 2.50mm)
Temperature Coefficient: ±200ppm/°C
Package / Case: 8-SIP
Number of Pins: 8
Circuit Type: Isolated
Power Per Element: 200mW
Tolerance: ±5%
Resistance (Ohms): 22k
Packaging: Bulk
Number of Resistors: 4
Height - Seated (Max): 0.200" (5.08mm)
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Технічний опис SIL08M223J TE Connectivity Passive Product

Description: RES ARRAY 4 RES 22K OHM 8SIP, Operating Temperature: -55°C ~ 125°C, Mounting Type: Through Hole, Size / Dimension: 0.800" L x 0.098" W (20.32mm x 2.50mm), Temperature Coefficient: ±200ppm/°C, Package / Case: 8-SIP, Number of Pins: 8, Circuit Type: Isolated, Power Per Element: 200mW, Tolerance: ±5%, Resistance (Ohms): 22k, Packaging: Bulk, Number of Resistors: 4, Height - Seated (Max): 0.200" (5.08mm).