Технічний опис SLM-103-01-F-S Samtec
Description: .050 MICRO STRIPS, Packaging: Bulk, Connector Type: Receptacle, Mounting Type: Through Hole, Number of Positions: 3, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Length - Post: 0.115" (2.92mm), Insulation Height: 0.180" (4.57mm), Number of Rows: 1.
Інші пропозиції SLM-103-01-F-S
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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SLM-103-01-F-S | Виробник : Samtec Inc. |
 Description: .050 MICRO STRIPSPackaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole Number of Positions: 3 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Contact Length - Post: 0.115" (2.92mm) Insulation Height: 0.180" (4.57mm) Number of Rows: 1 |
товару немає в наявності |
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SLM-103-01-F-S | Виробник : Samtec |
Headers & Wire Housings Through-Hole Micro Socket, 0.050" x 0.100" Pitch |
товару немає в наявності |