SMD2SWLF.020 2OZ Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Form: Spool, 2 oz (56.70g)
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.020" (0.51mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
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Технічний опис SMD2SWLF.020 2OZ Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP, Form: Spool, 2 oz (56.70g), Melting Point: 441°F (227°C), Type: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Packaging: Bulk, Part Status: Active, Flux Type: No-Clean, Water Soluble, Process: Lead Free.