SMDAL50

SMDAL50 Chip Quik Inc.


SMDAL50.pdf Виробник: Chip Quik Inc.
Description: ALUMINUM SOLDER PASTE WATER-SOLU
Packaging: Bulk
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Solder Paste
Melting Point: 430°F (221°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 6 шт:

термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1751.74 грн
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Технічний опис SMDAL50 Chip Quik Inc.

Description: ALUMINUM SOLDER PASTE WATER-SOLU, Packaging: Bulk, Composition: Sn96.5Ag3.5 (96.5/3.5), Type: Solder Paste, Melting Point: 430°F (221°C), Form: Jar, 1.76 oz (50g), Mesh Type: 3, Process: Lead Free, Flux Type: Water Soluble, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 12 Months.