SMDLTLFP10T4 Chip Quik Inc.
Виробник: Chip Quik Inc.Description: SOLDER PASTE LOW TEMP T4 10CC
Packaging: Syringe
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
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Технічний опис SMDLTLFP10T4 Chip Quik Inc.
Description: SOLDER PASTE LOW TEMP T4 10CC, Packaging: Syringe, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Type: Solder Paste, Melting Point: 281°F (138°C), Form: Syringe, 1.23 oz (35g), 10cc, Mesh Type: 4, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.