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Технічний опис SMPX-20LCC-N Kycon
Description: SMT PLCC SOCKET 20P NON POLARISE, Features: Closed Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: PLCC, Operating Temperature: -50°C ~ 105°C, Number of Positions or Pins (Grid): 20 (4 x 5), Termination: Solder, Housing Material: Thermoplastic, Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 160.0µin (4.06µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Tin, Contact Material - Post: Phosphor Bronze.
Інші пропозиції SMPX-20LCC-N
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| SMPX-20LCC-N | Kycon, Inc. |
Description: SMT PLCC SOCKET 20P NON POLARISEFeatures: Closed Frame Packaging: Tube Mounting Type: Surface Mount Type: PLCC Operating Temperature: -50°C ~ 105°C Number of Positions or Pins (Grid): 20 (4 x 5) Termination: Solder Housing Material: Thermoplastic, Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
Мінімальне замовлення: 507 шт В кошику од. на суму грн. |
| SMPX-20LCC-N |
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Виробник: Kycon, Inc.
Description: SMT PLCC SOCKET 20P NON POLARISE
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: PLCC
Operating Temperature: -50°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Thermoplastic, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Description: SMT PLCC SOCKET 20P NON POLARISE
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: PLCC
Operating Temperature: -50°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Thermoplastic, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
товару немає в наявності
Мінімальне замовлення: 507 шт
В кошику
од. на суму грн.



