SU1210000000G Amphenol Anytek
Виробник: Amphenol Anytek
Description: SU-2*6P BLACK ; 10.0MM CLIP PLA
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: FLASH
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Brass
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS)
Termination: Solder
Number of Positions or Pins (Grid): 12 (2 x 6)
Operating Temperature: -40°C ~ 105°C
Type: DIP, 0.1" (2.54mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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Технічний опис SU1210000000G Amphenol Anytek
Description: SU-2*6P BLACK ; 10.0MM CLIP PLA, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: FLASH, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Brass, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Termination: Solder, Number of Positions or Pins (Grid): 12 (2 x 6), Operating Temperature: -40°C ~ 105°C, Type: DIP, 0.1" (2.54mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції SU1210000000G
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| SU1210000000G | Виробник : Amphenol Anytek |
 Fixed Terminal Blocks |
товару немає в наявності |