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TC74LCX244FTELM Toshiba Semiconductor and Storage
Виробник: Toshiba Semiconductor and StorageDescription: IC BUF NON-INVERT 3.6V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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Технічний опис TC74LCX244FTELM Toshiba Semiconductor and Storage
Description: IC BUF NON-INVERT 3.6V 20TSSOP, Packaging: Tape & Reel (TR), Package / Case: 20-TSSOP (0.173", 4.40mm Width), Output Type: 3-State, Mounting Type: Surface Mount, Number of Elements: 2, Logic Type: Buffer, Non-Inverting, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 1.65V ~ 3.6V, Number of Bits per Element: 4, Current - Output High, Low: 24mA, 24mA, Supplier Device Package: 20-TSSOP, Part Status: Obsolete.
Інші пропозиції TC74LCX244FTELM
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TC74LCX244FTELM | Виробник : Toshiba Semiconductor and Storage |
Description: IC BUF NON-INVERT 3.6V 20TSSOP Packaging: Cut Tape (CT) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 20-TSSOP Part Status: Obsolete |
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