TE0865-02-FBE83MA Trenz Electronic GmbH
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
Flash Size: 256MB
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
Flash Size: 256MB
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Технічний опис TE0865-02-FBE83MA Trenz Electronic GmbH
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL, Packaging: Bulk, Connector Type: B2B, Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm), RAM Size: 4GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: FPGA, Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E, Flash Size: 256MB.