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TI60F225Q3

TI60F225Q3 Efinix, Inc.

titanium60-ds-v2.0.pdf Виробник: Efinix, Inc.
Description: FPGA TITAN140HSIO 4PLL LP 225BGA
Packaging: Tray
Package / Case: 225-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 62016
Supplier Device Package: 225-FBGA (10x10)
Total RAM Bits: 2726298
Grade: Automotive
Number of I/O: 163
Qualification: AEC-Q100
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Технічний опис TI60F225Q3 Efinix, Inc.

Description: FPGA TITAN140HSIO 4PLL LP 225BGA, Packaging: Tray, Package / Case: 225-TFBGA, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TJ), Voltage - Supply: 0.92V ~ 0.98V, Number of Logic Elements/Cells: 62016, Supplier Device Package: 225-FBGA (10x10), Total RAM Bits: 2726298, Grade: Automotive, Number of I/O: 163, Qualification: AEC-Q100.