TI900-24-21.01-0.12-0 t-Global Technology
Виробник: t-Global Technology
Description: THERM PAD 24MMX21.01MM WHT
Backing, Carrier: Viscose
Thermal Conductivity: 1.8W/m-K
Outline: 24.00mm x 21.01mm
Type: Conductive Insulator Pad
Thickness: 0.0050" (0.127mm)
Shape: Rectangular
Material: Silicone
Color: White
Packaging: Box
| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 39.26 грн |
| 10+ | 33.73 грн |
| 25+ | 32.11 грн |
| 50+ | 29.02 грн |
| 100+ | 27.98 грн |
| 250+ | 26.65 грн |
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Технічний опис TI900-24-21.01-0.12-0 t-Global Technology
Description: THERM PAD 24MMX21.01MM WHT, Backing, Carrier: Viscose, Thermal Conductivity: 1.8W/m-K, Outline: 24.00mm x 21.01mm, Type: Conductive Insulator Pad, Thickness: 0.0050" (0.127mm), Shape: Rectangular, Material: Silicone, Color: White, Packaging: Box.