TLP2955(MBD,F) Toshiba Semiconductor and Storage


TLP2955_Rev2.0_2-17-16.pdf Виробник: Toshiba Semiconductor and Storage
Description: PHOTOCOUPLER
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Push-Pull, Totem Pole
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 20V
Voltage - Forward (Vf) (Typ): 1.55V
Data Rate: 5Mbps
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - DC Forward (If) (Max): 25mA
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-DIP
Common Mode Transient Immunity (Min): 20kV/µs
Propagation Delay tpLH / tpHL (Max): 250ns, 250ns
Part Status: Last Time Buy
Number of Channels: 1
Current - Output / Channel: 25 mA
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Технічний опис TLP2955(MBD,F) Toshiba Semiconductor and Storage

Description: PHOTOCOUPLER, Packaging: Bulk, Package / Case: 8-DIP (0.300", 7.62mm), Output Type: Push-Pull, Totem Pole, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 3V ~ 20V, Voltage - Forward (Vf) (Typ): 1.55V, Data Rate: 5Mbps, Input Type: DC, Voltage - Isolation: 5000Vrms, Current - DC Forward (If) (Max): 25mA, Inputs - Side 1/Side 2: 1/0, Supplier Device Package: 8-DIP, Common Mode Transient Immunity (Min): 20kV/µs, Propagation Delay tpLH / tpHL (Max): 250ns, 250ns, Part Status: Last Time Buy, Number of Channels: 1, Current - Output / Channel: 25 mA.