TMS5704357BGWTSEP Texas Instruments
Виробник: Texas Instruments
Description: PROTOTYPE
Packaging: Bulk
Package / Case: 337-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 41x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 337-NFBGA (16x16)
Number of I/O: 145
Description: PROTOTYPE
Packaging: Bulk
Package / Case: 337-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 41x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 337-NFBGA (16x16)
Number of I/O: 145
товару немає в наявності
Відгуки про товар
Написати відгук
Технічний опис TMS5704357BGWTSEP Texas Instruments
Description: PROTOTYPE, Packaging: Bulk, Package / Case: 337-LFBGA, Mounting Type: Surface Mount, Speed: 300MHz, Program Memory Size: 4MB (4M x 8), RAM Size: 512K x 8, Operating Temperature: -55°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: Arm® Cortex®-R5F, Data Converters: A/D 41x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, Peripherals: DMA, POR, PWM, WDT, Supplier Device Package: 337-NFBGA (16x16), Number of I/O: 145.