TOLC-105-02-F-Q-A Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER SMD 20POS 1.27MM
Features: Board Guide
Packaging: Tube
Connector Type: Header
Current Rating (Amps): 2.4A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 4
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.220" (5.60mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.100" (2.54mm)
на замовлення 637 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 978.87 грн |
| 10+ | 835.66 грн |
| 100+ | 728.51 грн |
| 500+ | 583.14 грн |
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Технічний опис TOLC-105-02-F-Q-A Samtec Inc.
Description: CONN HEADER SMD 20POS 1.27MM, Features: Board Guide, Packaging: Tube, Connector Type: Header, Current Rating (Amps): 2.4A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 4, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Gold, Part Status: Active, Contact Shape: Square, Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.100" (2.54mm).