WB100FC120ALZ WeEn Semiconductors
Виробник: WeEn Semiconductors
Description: WB100FC120AL/NAU000/NO MARK*CHIP
Packaging: Bulk
Part Status: Active
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 90 ns
Technology: Standard
Current - Average Rectified (Io): 100A
Supplier Device Package: Wafer
Operating Temperature - Junction: 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 3.3 V @ 100 A
Current - Reverse Leakage @ Vr: 250 µA @ 1200 V
Description: WB100FC120AL/NAU000/NO MARK*CHIP
Packaging: Bulk
Part Status: Active
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 90 ns
Technology: Standard
Current - Average Rectified (Io): 100A
Supplier Device Package: Wafer
Operating Temperature - Junction: 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 3.3 V @ 100 A
Current - Reverse Leakage @ Vr: 250 µA @ 1200 V
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Технічний опис WB100FC120ALZ WeEn Semiconductors
Description: WB100FC120AL/NAU000/NO MARK*CHIP, Packaging: Bulk, Part Status: Active, Package / Case: Die, Mounting Type: Surface Mount, Speed: Fast Recovery =< 500ns, > 200mA (Io), Reverse Recovery Time (trr): 90 ns, Technology: Standard, Current - Average Rectified (Io): 100A, Supplier Device Package: Wafer, Operating Temperature - Junction: 175°C, Voltage - DC Reverse (Vr) (Max): 1200 V, Voltage - Forward (Vf) (Max) @ If: 3.3 V @ 100 A, Current - Reverse Leakage @ Vr: 250 µA @ 1200 V.