WIREFC-501322-0454 Indium Corporation of America
Виробник: Indium Corporation of America
Description: SAC305 CW818 3% 0.050" 1LB
Packaging: Spool
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 428°F (220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 120 Months
Description: SAC305 CW818 3% 0.050" 1LB
Packaging: Spool
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 428°F (220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 120 Months
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Технічний опис WIREFC-501322-0454 Indium Corporation of America
Description: SAC305 CW818 3% 0.050" 1LB, Packaging: Spool, Diameter: 0.050" (1.27mm), Wire Gauge: 16 AWG, 18 SWG, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 428°F (220°C), Form: Spool, 1 lb (454 g), Process: Lead Free, Flux Type: No-Clean, Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C), Shelf Life Start: Date of Manufacture, Shelf Life: 120 Months.