WP21-S046VA1-R8000 JAE Electronics
Виробник: JAE Electronics
Description: Interconnect Rectangular
Features: Solder Retention
Packaging: Bulk
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 46
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 3.94µin (0.100µm)
Number of Rows: 2
Description: Interconnect Rectangular
Features: Solder Retention
Packaging: Bulk
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 46
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 3.94µin (0.100µm)
Number of Rows: 2
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Технічний опис WP21-S046VA1-R8000 JAE Electronics
Description: Interconnect Rectangular, Features: Solder Retention, Packaging: Bulk, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 46, Pitch: 0.014" (0.35mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 3.94µin (0.100µm), Number of Rows: 2.