XC6SLX75-N3FGG676I AMD
Виробник: AMDDescription: IC FPGA 408 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74637
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5831
Total RAM Bits: 3170304
Number of I/O: 408
DigiKey Programmable: Not Verified
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Технічний опис XC6SLX75-N3FGG676I AMD
Description: IC FPGA 408 I/O 676FBGA, Packaging: Tray, Package / Case: 676-BGA, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 1.14V ~ 1.26V, Number of Logic Elements/Cells: 74637, Supplier Device Package: 676-FBGA (27x27), Number of LABs/CLBs: 5831, Total RAM Bits: 3170304, Number of I/O: 408, DigiKey Programmable: Not Verified.