Продукція > AMD > XCVH1582-1LSEVSVA3697

XCVH1582-1LSEVSVA3697 AMD

Виробник: AMD
Description: XCVH1582-1LSEVSVA3697
Packaging: Bulk
Package / Case: 3697-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ HBM FPGA, 3M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3697-FCBGA (57.5x57.5)
Architecture: MPU, FPGA

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Технічний опис XCVH1582-1LSEVSVA3697 AMD

Description: XCVH1582-1LSEVSVA3697, Packaging: Bulk, Package / Case: 3697-BFBGA, FCBGA, Speed: 400MHz, 1GHz, RAM Size: 256KB, Operating Temperature: 0°C ~ 100°C (TJ), Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, Primary Attributes: Versal™ HBM FPGA, 3M Logic Cells, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, Peripherals: DDR, DMA, PCIe, Supplier Device Package: 3697-FCBGA (57.5x57.5), Architecture: MPU, FPGA.