XIAO ESP32C3 SEEED STUDIO
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-C3
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Connection: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: RISC-V
Operating temperature: -40...85°C
Memory: 400kB SRAM; 4MB FLASH
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-C3
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Connection: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: RISC-V
Operating temperature: -40...85°C
Memory: 400kB SRAM; 4MB FLASH
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
на замовлення 22 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 452.27 грн |
| 3+ | 401.38 грн |
| 10+ | 369.26 грн |
Відгуки про товар
Написати відгук
Технічний опис XIAO ESP32C3 SEEED STUDIO
Category: Development kits for data transmission, Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO, Type of development kit: evaluation, Bluetooth version: 5.0, Components: ESP32-C3, Interface: ADC; GPIO; I2C; I2S; SPI; UART, Connection: solder pads; U.FL; USB C socket, Communictions protocol: WIFI, Manufacturer series: XIAO, Number of pins: 2x 7, Kind of architecture: RISC-V, Operating temperature: -40...85°C, Memory: 400kB SRAM; 4MB FLASH, Dimensions: 21x17.5mm, WiFi: 2,4GHz, Kit contents: prototype board; u.FL antenna.