XIAO ESP32C3 SEEED STUDIO
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO
Type of development kit: evaluation
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH
Components: ESP32-C3
Kind of connector: solder pads; U.FL; USB C socket
Kit contents: prototype board; u.FL antenna
Communictions protocol: Bluetooth 5.0; WIFI
Dimensions: 21x17.5mm
Manufacturer series: XIAO
Operating temperature: -40...85°C
Kind of architecture: RISC-V
Number of pins: 2x 7
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO
Type of development kit: evaluation
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH
Components: ESP32-C3
Kind of connector: solder pads; U.FL; USB C socket
Kit contents: prototype board; u.FL antenna
Communictions protocol: Bluetooth 5.0; WIFI
Dimensions: 21x17.5mm
Manufacturer series: XIAO
Operating temperature: -40...85°C
Kind of architecture: RISC-V
Number of pins: 2x 7
кількість в упаковці: 1 шт
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Технічний опис XIAO ESP32C3 SEEED STUDIO
Category: Development kits for data transmission, Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO, Type of development kit: evaluation, Interface: ADC; GPIO; I2C; I2S; SPI; UART, Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH, Components: ESP32-C3, Kind of connector: solder pads; U.FL; USB C socket, Kit contents: prototype board; u.FL antenna, Communictions protocol: Bluetooth 5.0; WIFI, Dimensions: 21x17.5mm, Manufacturer series: XIAO, Operating temperature: -40...85°C, Kind of architecture: RISC-V, Number of pins: 2x 7, кількість в упаковці: 1 шт.
Інші пропозиції XIAO ESP32C3
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XIAO ESP32C3 | Виробник : SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO Type of development kit: evaluation Interface: ADC; GPIO; I2C; I2S; SPI; UART Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH Components: ESP32-C3 Kind of connector: solder pads; U.FL; USB C socket Kit contents: prototype board; u.FL antenna Communictions protocol: Bluetooth 5.0; WIFI Dimensions: 21x17.5mm Manufacturer series: XIAO Operating temperature: -40...85°C Kind of architecture: RISC-V Number of pins: 2x 7 |
товар відсутній |