
XR2C-2015 Omron Electronics Inc-EMC Div

Description: CONN SOCKET SIP 20POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 43 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна |
---|---|
1+ | 349.31 грн |
10+ | 286.84 грн |
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Технічний опис XR2C-2015 Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 20POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (1 x 20), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції XR2C-2015
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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XR2C-2015 | Виробник : Omron Electronics |
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товару немає в наявності |