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HA3-2625-5 HA3-2625-5 Renesas Electronics America Inc HA-2620,25.pdf Description: IC OPAMP GP 1 CIRCUIT 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Amplifier Type: General Purpose
Operating Temperature: 0°C ~ 75°C
Current - Supply: 3mA
Slew Rate: 35V/µs
Gain Bandwidth Product: 100 MHz
Current - Input Bias: 5 nA
Voltage - Input Offset: 3 mV
Supplier Device Package: 8-PDIP
Part Status: Obsolete
Number of Circuits: 1
Current - Output / Channel: 18 mA
Voltage - Supply Span (Min): 10 V
Voltage - Supply Span (Max): 40 V
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R7F7016514ABG-C#AC1 Renesas Electronics America Inc Description: 32BIT MCU RH850/F1KM-S4
Packaging: Tray
Package / Case: 233-FBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FBGA (15x15)
Part Status: Active
Number of I/O: 174
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R7F7016513ABG-C#HC1 Renesas Electronics America Inc rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110 Description: IC MCU 32BIT 4MB FLASH 233FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7016514ABG-C#BC1 Renesas Electronics America Inc rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110 Description: IC MCU 32BIT 4MB FLASH 233FPBGA
Packaging: Tray
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7017114ABG-C#BC1 Renesas Electronics America Inc rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110 Description: IC MCU 32BIT 8MB FLASH 233FPBGA
Packaging: Tray
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1M x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7016513ABG-C#BC1 Renesas Electronics America Inc rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110 Description: IC MCU 32BIT 4MB FLASH 233FPBGA
Packaging: Tray
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7016533ABG-C#HC1 Renesas Electronics America Inc rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110 Description: IC MCU 32BIT 4MB FLASH 272FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 272-FPBGA
Part Status: Active
Number of I/O: 214
DigiKey Programmable: Not Verified
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R7F7017113ABG-C#BC1 Renesas Electronics America Inc rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110 Description: IC MCU 32BIT 8MB FLASH 233FPBGA
Packaging: Tray
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1M x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7017153ABG-C#HC1 Renesas Electronics America Inc rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110 Description: IC MCU 32BIT 8MB FLASH 324BGA
Packaging: Tape & Reel (TR)
Package / Case: 324-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1M x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 324-BGA
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
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R7F7017153ABG-C#BC1 Renesas Electronics America Inc rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110 Description: IC MCU 32BIT 8MB FLASH 324BGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1M x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 324-BGA
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
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R7F7016514ABG-C#HC1 Renesas Electronics America Inc Description: 32BIT MCU RH850/F1KM-S4 BGA233 +
Packaging: Tape & Reel (TR)
Package / Case: 233-FBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FBGA (15x15)
Part Status: Active
Number of I/O: 174
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HIN207EIBZ HIN207EIBZ Renesas Electronics America Inc hin202e-hin206e-hin207e-hin208e-hin211e-hin213e-hin232e-datasheet Description: IC TRANSCEIVER FULL 5/3 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 5/3
Data Rate: 230kbps
Protocol: RS232
Supplier Device Package: 24-SOIC
Receiver Hysteresis: 500 mV
Duplex: Full
Part Status: Obsolete
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HIN207ECB-T HIN207ECB-T Renesas Electronics America Inc hin202e-hin206e-hin207e-hin208e-hin211e-hin213e-hin232e-datasheet Description: IC TRANSCEIVER FULL 5/3 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 5/3
Data Rate: 230kbps
Protocol: RS232
Supplier Device Package: 24-SOIC
Receiver Hysteresis: 500 mV
Duplex: Full
Part Status: Obsolete
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HIN207ECB HIN207ECB Renesas Electronics America Inc hin202e-hin206e-hin207e-hin208e-hin211e-hin213e-hin232e-datasheet Description: IC TRANSCEIVER FULL 5/3 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 5/3
Data Rate: 230kbps
Protocol: RS232
Supplier Device Package: 24-SOIC
Receiver Hysteresis: 500 mV
Duplex: Full
Part Status: Obsolete
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HIN207EIB-T HIN207EIB-T Renesas Electronics America Inc hin202e-hin206e-hin207e-hin208e-hin211e-hin213e-hin232e-datasheet Description: IC TRANSCEIVER FULL 5/3 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 5/3
Data Rate: 230kbps
Protocol: RS232
Supplier Device Package: 24-SOIC
Receiver Hysteresis: 500 mV
Duplex: Full
Part Status: Obsolete
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R5F5671EHDFB#10 R5F5671EHDFB#10 Renesas Electronics America Inc rx671-group-datasheet-rev100?language=en&r=1527301 Description: IC MCU 32BIT 2MB FLASH 144LFQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv3
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LFQFP (20x20)
Part Status: Active
Number of I/O: 113
DigiKey Programmable: Not Verified
на замовлення 474 шт:
термін постачання 21-31 дні (днів)
1+1047.75 грн
10+927.34 грн
25+888.86 грн
80+734.97 грн
230+698.90 грн
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R5F5671EHGFP#30 R5F5671EHGFP#30 Renesas Electronics America Inc rx671-group-datasheet-rev100 Description: IC MCU 32BIT 2MB FLASH 100LFQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LFQFP (14x14)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
1+1047.75 грн
10+927.34 грн
25+888.86 грн
90+734.97 грн
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R5F565NEHGLK#20 R5F565NEHGLK#20 Renesas Electronics America Inc rx65n-group-rx651-group-datasheet-rev230?r=1054466 Description: IC MCU 32BIT 2MB FLASH 145TFLGA
Packaging: Tray
Package / Case: 145-TFLGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: RXv2
Data Converters: A/D 29x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 145-TFLGA (7x7)
Part Status: Active
Number of I/O: 111
DigiKey Programmable: Not Verified
на замовлення 416 шт:
термін постачання 21-31 дні (днів)
1+1216.75 грн
10+1076.74 грн
25+1032.10 грн
80+853.39 грн
416+811.50 грн
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RJK4006DPP-G1#T2 Renesas Electronics America Inc Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Part Status: Active
на замовлення 8032 шт:
термін постачання 21-31 дні (днів)
189+131.07 грн
Мінімальне замовлення: 189
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RJK4006DPD-WS#J2 Renesas Electronics America Inc Description: MOSFET N-CH 400V 8A MP3A
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: 150°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8A (Ta)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 1mA
Supplier Device Package: MP-3A
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 400 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 620 pF @ 25 V
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RJK4006DPD-00#J2 RJK4006DPD-00#J2 Renesas Electronics America Inc rjk4006dpd-datasheet?language=en Description: MOSFET N-CH 400V 8A MP3A
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8A (Ta)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4A, 10V
Power Dissipation (Max): 65W (Tc)
Supplier Device Package: MP-3A
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 400 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 620 pF @ 25 V
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R5F51403ADNE#30 R5F51403ADNE#30 Renesas Electronics America Inc rx140-group-datasheet-rev110?r=1531576 Description: 32BIT MCU RX140 64K HWQFN48 -40/
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: RXv2
Data Converters: A/D 11x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: AES, DMA, LVD, POR, PWM, Temp Sensor, Touch-Sense, TRNG, WDT
Supplier Device Package: 48-HWQFN (7x7)
Part Status: Active
Number of I/O: 39
на замовлення 1248 шт:
термін постачання 21-31 дні (днів)
2+179.71 грн
10+158.21 грн
25+153.91 грн
40+143.70 грн
80+128.45 грн
416+128.08 грн
832+122.25 грн
1248+118.81 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
R5F51308AGNE#20 Renesas Electronics America Inc rx130-group-datasheet-rev300?r=1054356 Description: 32BIT MCU RX130 512K HWQFN48 -40
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Part Status: Active
Number of I/O: 38
на замовлення 416 шт:
термін постачання 21-31 дні (днів)
1+419.60 грн
10+366.51 грн
25+358.52 грн
40+334.64 грн
80+300.06 грн
416+298.96 грн
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KA4L4M(0)-T1-A Renesas Electronics America Inc KA4yyy_4-1-10.pdf Description: TRANSISTOR NPN USM SC-75
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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RC19013AGNG#BB0 Renesas Electronics America Inc rc190xx-datasheet?r=1565151 Description: IC CLK FANOUT/BUFF ZD 64TSSOP
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
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ISL88750HRZ ISL88750HRZ Renesas Electronics America Inc isl88750-data-short Description: IC BATT CHG LI-ION 2-4CELL 32QFN
Packaging: Tube
Package / Case: 32-VFQFN Exposed Pad
Number of Cells: 2 ~ 4
Mounting Type: Surface Mount
Interface: SMBus
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 32-QFN (4x4)
Voltage - Supply (Max): 22V
Part Status: Active
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R5F524T8AGFK#11 R5F524T8AGFK#11 Renesas Electronics America Inc Description: IC MCU 32BIT 128MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (14x14)
Number of I/O: 48
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R5F524T8AGFF#11 R5F524T8AGFF#11 Renesas Electronics America Inc Description: 32BIT MCU RX24T 128K LQFP80 -40/
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 17x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 60
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UPC8172TB-E3-A UPC8172TB-E3-A Renesas Electronics America Inc RNCC-S-A0001290066-1.pdf?t.download=true&u=5oefqw Description: DOUBLE BALANCED MIXER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 50MHz ~ 400MHz
RF Type: Cellular, DCS, PCS, W-CDMA, WLAN
Voltage - Supply: 2.7V ~ 3.3V
Gain: 9.5dB
Current - Supply: 13mA
Secondary Attributes: Up Converter
Noise Figure: 9.5dB
Number of Mixers: 1
Supplier Device Package: 6-SuperMiniMold
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R5F51405AGFN#30 R5F51405AGFN#30 Renesas Electronics America Inc Description: 32BIT MCU RX140 128K LFQFP80 -40
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 18x12b; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: AES, DMA, LVD, POR, PWM, Temp Sensor, Touch-Sense, TRNG, WDT
Supplier Device Package: 80-LFQFP (12x12)
Number of I/O: 69
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PS9513L2-V-E3-AX PS9513L2-V-E3-AX Renesas Electronics America Inc ps9513ps9513l1ps9513l2ps9513l3-data-sheet Description: HI-SPD OPTOCPLR 8-PIN DIP
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing
Output Type: Open Collector
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Voltage - Supply: 4.5V ~ 20V
Voltage - Forward (Vf) (Typ): 1.65V
Data Rate: 1Mbps
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - DC Forward (If) (Max): 25mA
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-SMD
Common Mode Transient Immunity (Min): 15kV/µs
Propagation Delay tpLH / tpHL (Max): 750ns, 500ns
Number of Channels: 1
Current - Output / Channel: 15 mA
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PS9513L2-V-E3-AX PS9513L2-V-E3-AX Renesas Electronics America Inc ps9513ps9513l1ps9513l2ps9513l3-data-sheet Description: HI-SPD OPTOCPLR 8-PIN DIP
Packaging: Cut Tape (CT)
Package / Case: 8-SMD, Gull Wing
Output Type: Open Collector
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Voltage - Supply: 4.5V ~ 20V
Voltage - Forward (Vf) (Typ): 1.65V
Data Rate: 1Mbps
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - DC Forward (If) (Max): 25mA
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-SMD
Common Mode Transient Immunity (Min): 15kV/µs
Propagation Delay tpLH / tpHL (Max): 750ns, 500ns
Number of Channels: 1
Current - Output / Channel: 15 mA
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PS9513L3-V-E3-AX PS9513L3-V-E3-AX Renesas Electronics America Inc ps9513ps9513l1ps9513l2ps9513l3-data-sheet Description: HI-SPD OPTOCPLR 8-PIN DIP
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing
Output Type: Open Collector
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Voltage - Supply: 4.5V ~ 20V
Voltage - Forward (Vf) (Typ): 1.65V
Data Rate: 1Mbps
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - DC Forward (If) (Max): 25mA
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-SMD
Common Mode Transient Immunity (Min): 15kV/µs
Propagation Delay tpLH / tpHL (Max): 750ns, 500ns
Number of Channels: 1
Current - Output / Channel: 15 mA
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PS9513L3-V-E3-AX PS9513L3-V-E3-AX Renesas Electronics America Inc ps9513ps9513l1ps9513l2ps9513l3-data-sheet Description: HI-SPD OPTOCPLR 8-PIN DIP
Packaging: Cut Tape (CT)
Package / Case: 8-SMD, Gull Wing
Output Type: Open Collector
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Voltage - Supply: 4.5V ~ 20V
Voltage - Forward (Vf) (Typ): 1.65V
Data Rate: 1Mbps
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - DC Forward (If) (Max): 25mA
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-SMD
Common Mode Transient Immunity (Min): 15kV/µs
Propagation Delay tpLH / tpHL (Max): 750ns, 500ns
Number of Channels: 1
Current - Output / Channel: 15 mA
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ISL99360BFRZ-T Renesas Electronics America Inc isl99360-isl99360b-short-form-datasheet?r=1393596 Description: 5V SMART POWER STAGE GEN2 (SPS)
Packaging: Tape & Reel (TR)
на замовлення 111000 шт:
термін постачання 21-31 дні (днів)
3000+480.46 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
ISL99360FRZ-T Renesas Electronics America Inc isl99360-isl99360b-short-form-datasheet?r=1393596 Description: SMART POWER STAGE GEN2 (SPS) MOD
Packaging: Tape & Reel (TR)
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ISL55004IBZ-T7 ISL55004IBZ-T7 Renesas Electronics America Inc isl55004-datasheet Description: IC OPAMP VFB 4 CIRCUIT 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Amplifier Type: Voltage Feedback
Operating Temperature: -40°C ~ 85°C
Current - Supply: 8.5mA (x4 Channels)
Slew Rate: 300V/µs
Gain Bandwidth Product: 70 MHz
Current - Input Bias: 600 nA
Voltage - Input Offset: 1.2 mV
Supplier Device Package: 14-SOIC
Number of Circuits: 4
Current - Output / Channel: 140 mA
-3db Bandwidth: 200 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 30 V
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ISL55004IBZ-T7 ISL55004IBZ-T7 Renesas Electronics America Inc isl55004-datasheet Description: IC OPAMP VFB 4 CIRCUIT 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Amplifier Type: Voltage Feedback
Operating Temperature: -40°C ~ 85°C
Current - Supply: 8.5mA (x4 Channels)
Slew Rate: 300V/µs
Gain Bandwidth Product: 70 MHz
Current - Input Bias: 600 nA
Voltage - Input Offset: 1.2 mV
Supplier Device Package: 14-SOIC
Number of Circuits: 4
Current - Output / Channel: 140 mA
-3db Bandwidth: 200 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 30 V
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R5F572MDDDFB#30 R5F572MDDDFB#30 Renesas Electronics America Inc rx72m-group-datasheet-rev111?r=1054481 Description: 32BIT MCU RX72M 2MB LQFP144 -40/
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: RXv3
Data Converters: A/D 29x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LFQFP (20x20)
Number of I/O: 111
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
1+1417.89 грн
10+1264.24 грн
25+1247.09 грн
60+1155.65 грн
120+1012.77 грн
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R5F51306BGFM#30 R5F51306BGFM#30 Renesas Electronics America Inc rx130-group-datasheet-rev300 Description: IC MCU 32BIT 256KB FLASH 64LFQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 14x12b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Capacitive Touch, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LFQFP (10x10)
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 640 шт:
термін постачання 21-31 дні (днів)
1+427.02 грн
10+369.21 грн
25+349.06 грн
160+283.89 грн
320+269.34 грн
480+241.68 грн
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R5F51307ADFL#30 R5F51307ADFL#30 Renesas Electronics America Inc rx130-group-datasheet-rev300 Description: IC MCU 32BIT 384KB FLASH 48LFQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LFQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
1+463.29 грн
10+400.56 грн
25+378.65 грн
80+307.97 грн
250+292.18 грн
500+262.17 грн
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R5F51306BDNE#20 R5F51306BDNE#20 Renesas Electronics America Inc rx130-group-datasheet-rev300?r=1054356 Description: IC MCU 32BIT 256KB FLASH 48WFQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Capacitive Touch, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 38
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R5F51303ADFK#10 R5F51303ADFK#10 Renesas Electronics America Inc rx130-group-datasheet-rev300 Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 14x12b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
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R5F52318AGFP#30 R5F52318AGFP#30 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120 Description: IC MCU 32BIT 512KB FLSH 100LFQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LFQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
1+782.31 грн
10+680.23 грн
25+648.58 грн
90+528.51 грн
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R5F52318AGFL#10 R5F52318AGFL#10 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120?r=1054376 Description: 32BIT MCU RX231 512K LFQFP48 -40
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LFQFP (7x7)
Number of I/O: 30
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R5F52318AGFL#10 R5F52318AGFL#10 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120?r=1054376 Description: 32BIT MCU RX231 512K LFQFP48 -40
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LFQFP (7x7)
Number of I/O: 30
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R5F52318AGFL#30 R5F52318AGFL#30 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120?r=1054376 Description: 32BIT MCU RX231 512K LFQFP-48 -4
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LFQFP (7x7)
Number of I/O: 30
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R5F52318ADNE#20 R5F52318ADNE#20 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120 Description: IC MCU 32BIT 512KB FLASH 48HWQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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R5F52318ADND#20 R5F52318ADND#20 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120 Description: IC MCU 32BIT 512KB FLASH 64HWQFN
Packaging: Tray
Package / Case: 64-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-HWQFN (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
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R5F52318AGNE#20 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120?r=1054376 Description: IC MCU 32BIT 512KB FLASH 48HWQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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R5F52318AGND#20 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120?r=1054376 Description: IC MCU 32BIT 512KB FLASH 64HWQFN
Packaging: Tray
Package / Case: 64-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-HWQFN (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
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R5F52318BDNE#20 R5F52318BDNE#20 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120 Description: IC MCU 32BIT 512KB FLASH 48HWQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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R5F52318BDND#20 R5F52318BDND#20 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120 Description: IC MCU 32BIT 512KB FLASH 64HWQFN
Packaging: Tray
Package / Case: 64-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-HWQFN (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
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R5F52318BGNE#20 Renesas Electronics America Inc rx230-group-rx231-group-datasheet-rev120?r=1054376 Description: IC MCU 32BIT 512KB FLASH 48HWQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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HZM6.2NB2JTL-E HZM6.2NB2JTL-E Renesas Electronics America Inc Description: DIODE ZENER
Packaging: Bulk
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
1623+14.84 грн
Мінімальне замовлення: 1623
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HZM6.2NB2TL-E HZM6.2NB2TL-E Renesas Electronics America Inc RNCCS12280-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
Packaging: Bulk
на замовлення 4944 шт:
термін постачання 21-31 дні (днів)
1623+14.84 грн
Мінімальне замовлення: 1623
В кошику  од. на суму  грн.
HZM6.2NB2JTR-E HZM6.2NB2JTR-E Renesas Electronics America Inc Description: DIODE ZENER
Packaging: Bulk
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
1623+14.84 грн
Мінімальне замовлення: 1623
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XPP526155.520000I Renesas Electronics America Inc Description: XTAL OSC XO 155.5200MHZ LVPECL
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V
Current - Supply (Max): 94mA
Height - Seated (Max): 0.051" (1.30mm)
Frequency: 155.52 MHz
Base Resonator: Crystal
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XLM336048.000000I Renesas Electronics America Inc xl-family-low-phase-noise-quartz-based-pll-oscillators-datasheet Description: XTAL OSC XO 48.0000MHZ LVDS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 100mA
Height - Seated (Max): 0.039" (1.00mm)
Frequency: 48 MHz
Base Resonator: Crystal
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XLM336027.000000I Renesas Electronics America Inc xl-family-low-phase-noise-quartz-based-pll-oscillators-datasheet Description: XTAL OSC XO 27.0000MHZ LVDS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 100mA
Height - Seated (Max): 0.039" (1.00mm)
Frequency: 27 MHz
Base Resonator: Crystal
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HA3-2625-5 HA-2620,25.pdf
HA3-2625-5
Виробник: Renesas Electronics America Inc
Description: IC OPAMP GP 1 CIRCUIT 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Amplifier Type: General Purpose
Operating Temperature: 0°C ~ 75°C
Current - Supply: 3mA
Slew Rate: 35V/µs
Gain Bandwidth Product: 100 MHz
Current - Input Bias: 5 nA
Voltage - Input Offset: 3 mV
Supplier Device Package: 8-PDIP
Part Status: Obsolete
Number of Circuits: 1
Current - Output / Channel: 18 mA
Voltage - Supply Span (Min): 10 V
Voltage - Supply Span (Max): 40 V
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R7F7016514ABG-C#AC1
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RH850/F1KM-S4
Packaging: Tray
Package / Case: 233-FBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FBGA (15x15)
Part Status: Active
Number of I/O: 174
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R7F7016513ABG-C#HC1 rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 4MB FLASH 233FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7016514ABG-C#BC1 rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 4MB FLASH 233FPBGA
Packaging: Tray
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7017114ABG-C#BC1 rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 8MB FLASH 233FPBGA
Packaging: Tray
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1M x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7016513ABG-C#BC1 rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 4MB FLASH 233FPBGA
Packaging: Tray
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7016533ABG-C#HC1 rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 4MB FLASH 272FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 272-FPBGA
Part Status: Active
Number of I/O: 214
DigiKey Programmable: Not Verified
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R7F7017113ABG-C#BC1 rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 8MB FLASH 233FPBGA
Packaging: Tray
Package / Case: 233-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1M x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FPBGA
Part Status: Active
Number of I/O: 174
DigiKey Programmable: Not Verified
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R7F7017153ABG-C#HC1 rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 8MB FLASH 324BGA
Packaging: Tape & Reel (TR)
Package / Case: 324-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1M x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 324-BGA
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
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R7F7017153ABG-C#BC1 rh850f1km-rh850f1kh-users-manual-hardware-r01uh0684ej0110
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 8MB FLASH 324BGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1M x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 324-BGA
Part Status: Active
Number of I/O: 246
DigiKey Programmable: Not Verified
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R7F7016514ABG-C#HC1
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RH850/F1KM-S4 BGA233 +
Packaging: Tape & Reel (TR)
Package / Case: 233-FBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 233-FBGA (15x15)
Part Status: Active
Number of I/O: 174
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HIN207EIBZ hin202e-hin206e-hin207e-hin208e-hin211e-hin213e-hin232e-datasheet
HIN207EIBZ
Виробник: Renesas Electronics America Inc
Description: IC TRANSCEIVER FULL 5/3 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 5/3
Data Rate: 230kbps
Protocol: RS232
Supplier Device Package: 24-SOIC
Receiver Hysteresis: 500 mV
Duplex: Full
Part Status: Obsolete
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HIN207ECB-T hin202e-hin206e-hin207e-hin208e-hin211e-hin213e-hin232e-datasheet
HIN207ECB-T
Виробник: Renesas Electronics America Inc
Description: IC TRANSCEIVER FULL 5/3 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 5/3
Data Rate: 230kbps
Protocol: RS232
Supplier Device Package: 24-SOIC
Receiver Hysteresis: 500 mV
Duplex: Full
Part Status: Obsolete
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HIN207ECB hin202e-hin206e-hin207e-hin208e-hin211e-hin213e-hin232e-datasheet
HIN207ECB
Виробник: Renesas Electronics America Inc
Description: IC TRANSCEIVER FULL 5/3 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 5/3
Data Rate: 230kbps
Protocol: RS232
Supplier Device Package: 24-SOIC
Receiver Hysteresis: 500 mV
Duplex: Full
Part Status: Obsolete
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HIN207EIB-T hin202e-hin206e-hin207e-hin208e-hin211e-hin213e-hin232e-datasheet
HIN207EIB-T
Виробник: Renesas Electronics America Inc
Description: IC TRANSCEIVER FULL 5/3 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 5/3
Data Rate: 230kbps
Protocol: RS232
Supplier Device Package: 24-SOIC
Receiver Hysteresis: 500 mV
Duplex: Full
Part Status: Obsolete
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R5F5671EHDFB#10 rx671-group-datasheet-rev100?language=en&r=1527301
R5F5671EHDFB#10
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 2MB FLASH 144LFQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv3
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LFQFP (20x20)
Part Status: Active
Number of I/O: 113
DigiKey Programmable: Not Verified
на замовлення 474 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1047.75 грн
10+927.34 грн
25+888.86 грн
80+734.97 грн
230+698.90 грн
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R5F5671EHGFP#30 rx671-group-datasheet-rev100
R5F5671EHGFP#30
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 2MB FLASH 100LFQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LFQFP (14x14)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
на замовлення 180 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1047.75 грн
10+927.34 грн
25+888.86 грн
90+734.97 грн
В кошику  од. на суму  грн.
R5F565NEHGLK#20 rx65n-group-rx651-group-datasheet-rev230?r=1054466
R5F565NEHGLK#20
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 2MB FLASH 145TFLGA
Packaging: Tray
Package / Case: 145-TFLGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: RXv2
Data Converters: A/D 29x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 145-TFLGA (7x7)
Part Status: Active
Number of I/O: 111
DigiKey Programmable: Not Verified
на замовлення 416 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1216.75 грн
10+1076.74 грн
25+1032.10 грн
80+853.39 грн
416+811.50 грн
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RJK4006DPP-G1#T2
Виробник: Renesas Electronics America Inc
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Part Status: Active
на замовлення 8032 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
189+131.07 грн
Мінімальне замовлення: 189
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RJK4006DPD-WS#J2
Виробник: Renesas Electronics America Inc
Description: MOSFET N-CH 400V 8A MP3A
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: 150°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8A (Ta)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 1mA
Supplier Device Package: MP-3A
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 400 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 620 pF @ 25 V
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RJK4006DPD-00#J2 rjk4006dpd-datasheet?language=en
RJK4006DPD-00#J2
Виробник: Renesas Electronics America Inc
Description: MOSFET N-CH 400V 8A MP3A
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8A (Ta)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4A, 10V
Power Dissipation (Max): 65W (Tc)
Supplier Device Package: MP-3A
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 400 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 620 pF @ 25 V
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R5F51403ADNE#30 rx140-group-datasheet-rev110?r=1531576
R5F51403ADNE#30
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RX140 64K HWQFN48 -40/
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: RXv2
Data Converters: A/D 11x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: AES, DMA, LVD, POR, PWM, Temp Sensor, Touch-Sense, TRNG, WDT
Supplier Device Package: 48-HWQFN (7x7)
Part Status: Active
Number of I/O: 39
на замовлення 1248 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+179.71 грн
10+158.21 грн
25+153.91 грн
40+143.70 грн
80+128.45 грн
416+128.08 грн
832+122.25 грн
1248+118.81 грн
Мінімальне замовлення: 2
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R5F51308AGNE#20 rx130-group-datasheet-rev300?r=1054356
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RX130 512K HWQFN48 -40
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 10x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Part Status: Active
Number of I/O: 38
на замовлення 416 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+419.60 грн
10+366.51 грн
25+358.52 грн
40+334.64 грн
80+300.06 грн
416+298.96 грн
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KA4L4M(0)-T1-A KA4yyy_4-1-10.pdf
Виробник: Renesas Electronics America Inc
Description: TRANSISTOR NPN USM SC-75
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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RC19013AGNG#BB0 rc190xx-datasheet?r=1565151
Виробник: Renesas Electronics America Inc
Description: IC CLK FANOUT/BUFF ZD 64TSSOP
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
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ISL88750HRZ isl88750-data-short
ISL88750HRZ
Виробник: Renesas Electronics America Inc
Description: IC BATT CHG LI-ION 2-4CELL 32QFN
Packaging: Tube
Package / Case: 32-VFQFN Exposed Pad
Number of Cells: 2 ~ 4
Mounting Type: Surface Mount
Interface: SMBus
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 32-QFN (4x4)
Voltage - Supply (Max): 22V
Part Status: Active
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R5F524T8AGFK#11
R5F524T8AGFK#11
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 128MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (14x14)
Number of I/O: 48
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R5F524T8AGFF#11
R5F524T8AGFF#11
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RX24T 128K LQFP80 -40/
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 17x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 60
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UPC8172TB-E3-A RNCC-S-A0001290066-1.pdf?t.download=true&u=5oefqw
UPC8172TB-E3-A
Виробник: Renesas Electronics America Inc
Description: DOUBLE BALANCED MIXER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 50MHz ~ 400MHz
RF Type: Cellular, DCS, PCS, W-CDMA, WLAN
Voltage - Supply: 2.7V ~ 3.3V
Gain: 9.5dB
Current - Supply: 13mA
Secondary Attributes: Up Converter
Noise Figure: 9.5dB
Number of Mixers: 1
Supplier Device Package: 6-SuperMiniMold
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R5F51405AGFN#30
R5F51405AGFN#30
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RX140 128K LFQFP80 -40
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 18x12b; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: AES, DMA, LVD, POR, PWM, Temp Sensor, Touch-Sense, TRNG, WDT
Supplier Device Package: 80-LFQFP (12x12)
Number of I/O: 69
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PS9513L2-V-E3-AX ps9513ps9513l1ps9513l2ps9513l3-data-sheet
PS9513L2-V-E3-AX
Виробник: Renesas Electronics America Inc
Description: HI-SPD OPTOCPLR 8-PIN DIP
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing
Output Type: Open Collector
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Voltage - Supply: 4.5V ~ 20V
Voltage - Forward (Vf) (Typ): 1.65V
Data Rate: 1Mbps
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - DC Forward (If) (Max): 25mA
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-SMD
Common Mode Transient Immunity (Min): 15kV/µs
Propagation Delay tpLH / tpHL (Max): 750ns, 500ns
Number of Channels: 1
Current - Output / Channel: 15 mA
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PS9513L2-V-E3-AX ps9513ps9513l1ps9513l2ps9513l3-data-sheet
PS9513L2-V-E3-AX
Виробник: Renesas Electronics America Inc
Description: HI-SPD OPTOCPLR 8-PIN DIP
Packaging: Cut Tape (CT)
Package / Case: 8-SMD, Gull Wing
Output Type: Open Collector
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Voltage - Supply: 4.5V ~ 20V
Voltage - Forward (Vf) (Typ): 1.65V
Data Rate: 1Mbps
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - DC Forward (If) (Max): 25mA
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-SMD
Common Mode Transient Immunity (Min): 15kV/µs
Propagation Delay tpLH / tpHL (Max): 750ns, 500ns
Number of Channels: 1
Current - Output / Channel: 15 mA
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PS9513L3-V-E3-AX ps9513ps9513l1ps9513l2ps9513l3-data-sheet
PS9513L3-V-E3-AX
Виробник: Renesas Electronics America Inc
Description: HI-SPD OPTOCPLR 8-PIN DIP
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing
Output Type: Open Collector
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Voltage - Supply: 4.5V ~ 20V
Voltage - Forward (Vf) (Typ): 1.65V
Data Rate: 1Mbps
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - DC Forward (If) (Max): 25mA
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-SMD
Common Mode Transient Immunity (Min): 15kV/µs
Propagation Delay tpLH / tpHL (Max): 750ns, 500ns
Number of Channels: 1
Current - Output / Channel: 15 mA
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PS9513L3-V-E3-AX ps9513ps9513l1ps9513l2ps9513l3-data-sheet
PS9513L3-V-E3-AX
Виробник: Renesas Electronics America Inc
Description: HI-SPD OPTOCPLR 8-PIN DIP
Packaging: Cut Tape (CT)
Package / Case: 8-SMD, Gull Wing
Output Type: Open Collector
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C
Voltage - Supply: 4.5V ~ 20V
Voltage - Forward (Vf) (Typ): 1.65V
Data Rate: 1Mbps
Input Type: DC
Voltage - Isolation: 5000Vrms
Current - DC Forward (If) (Max): 25mA
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-SMD
Common Mode Transient Immunity (Min): 15kV/µs
Propagation Delay tpLH / tpHL (Max): 750ns, 500ns
Number of Channels: 1
Current - Output / Channel: 15 mA
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ISL99360BFRZ-T isl99360-isl99360b-short-form-datasheet?r=1393596
Виробник: Renesas Electronics America Inc
Description: 5V SMART POWER STAGE GEN2 (SPS)
Packaging: Tape & Reel (TR)
на замовлення 111000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+480.46 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
ISL99360FRZ-T isl99360-isl99360b-short-form-datasheet?r=1393596
Виробник: Renesas Electronics America Inc
Description: SMART POWER STAGE GEN2 (SPS) MOD
Packaging: Tape & Reel (TR)
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ISL55004IBZ-T7 isl55004-datasheet
ISL55004IBZ-T7
Виробник: Renesas Electronics America Inc
Description: IC OPAMP VFB 4 CIRCUIT 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Amplifier Type: Voltage Feedback
Operating Temperature: -40°C ~ 85°C
Current - Supply: 8.5mA (x4 Channels)
Slew Rate: 300V/µs
Gain Bandwidth Product: 70 MHz
Current - Input Bias: 600 nA
Voltage - Input Offset: 1.2 mV
Supplier Device Package: 14-SOIC
Number of Circuits: 4
Current - Output / Channel: 140 mA
-3db Bandwidth: 200 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 30 V
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ISL55004IBZ-T7 isl55004-datasheet
ISL55004IBZ-T7
Виробник: Renesas Electronics America Inc
Description: IC OPAMP VFB 4 CIRCUIT 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Amplifier Type: Voltage Feedback
Operating Temperature: -40°C ~ 85°C
Current - Supply: 8.5mA (x4 Channels)
Slew Rate: 300V/µs
Gain Bandwidth Product: 70 MHz
Current - Input Bias: 600 nA
Voltage - Input Offset: 1.2 mV
Supplier Device Package: 14-SOIC
Number of Circuits: 4
Current - Output / Channel: 140 mA
-3db Bandwidth: 200 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 30 V
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R5F572MDDDFB#30 rx72m-group-datasheet-rev111?r=1054481
R5F572MDDDFB#30
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RX72M 2MB LQFP144 -40/
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: RXv3
Data Converters: A/D 29x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LFQFP (20x20)
Number of I/O: 111
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1417.89 грн
10+1264.24 грн
25+1247.09 грн
60+1155.65 грн
120+1012.77 грн
В кошику  од. на суму  грн.
R5F51306BGFM#30 rx130-group-datasheet-rev300
R5F51306BGFM#30
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 256KB FLASH 64LFQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 14x12b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Capacitive Touch, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LFQFP (10x10)
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 640 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+427.02 грн
10+369.21 грн
25+349.06 грн
160+283.89 грн
320+269.34 грн
480+241.68 грн
В кошику  од. на суму  грн.
R5F51307ADFL#30 rx130-group-datasheet-rev300
R5F51307ADFL#30
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 384KB FLASH 48LFQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LFQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+463.29 грн
10+400.56 грн
25+378.65 грн
80+307.97 грн
250+292.18 грн
500+262.17 грн
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R5F51306BDNE#20 rx130-group-datasheet-rev300?r=1054356
R5F51306BDNE#20
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 256KB FLASH 48WFQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Capacitive Touch, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 38
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R5F51303ADFK#10 rx130-group-datasheet-rev300
R5F51303ADFK#10
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RX
Data Converters: A/D 14x12b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
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R5F52318AGFP#30 rx230-group-rx231-group-datasheet-rev120
R5F52318AGFP#30
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 512KB FLSH 100LFQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LFQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+782.31 грн
10+680.23 грн
25+648.58 грн
90+528.51 грн
В кошику  од. на суму  грн.
R5F52318AGFL#10 rx230-group-rx231-group-datasheet-rev120?r=1054376
R5F52318AGFL#10
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RX231 512K LFQFP48 -40
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LFQFP (7x7)
Number of I/O: 30
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R5F52318AGFL#10 rx230-group-rx231-group-datasheet-rev120?r=1054376
R5F52318AGFL#10
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RX231 512K LFQFP48 -40
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LFQFP (7x7)
Number of I/O: 30
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R5F52318AGFL#30 rx230-group-rx231-group-datasheet-rev120?r=1054376
R5F52318AGFL#30
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU RX231 512K LFQFP-48 -4
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LFQFP (7x7)
Number of I/O: 30
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R5F52318ADNE#20 rx230-group-rx231-group-datasheet-rev120
R5F52318ADNE#20
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 512KB FLASH 48HWQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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R5F52318ADND#20 rx230-group-rx231-group-datasheet-rev120
R5F52318ADND#20
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 512KB FLASH 64HWQFN
Packaging: Tray
Package / Case: 64-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-HWQFN (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
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R5F52318AGNE#20 rx230-group-rx231-group-datasheet-rev120?r=1054376
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 512KB FLASH 48HWQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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R5F52318AGND#20 rx230-group-rx231-group-datasheet-rev120?r=1054376
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 512KB FLASH 64HWQFN
Packaging: Tray
Package / Case: 64-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-HWQFN (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
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R5F52318BDNE#20 rx230-group-rx231-group-datasheet-rev120
R5F52318BDNE#20
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 512KB FLASH 48HWQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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R5F52318BDND#20 rx230-group-rx231-group-datasheet-rev120
R5F52318BDND#20
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 512KB FLASH 64HWQFN
Packaging: Tray
Package / Case: 64-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-HWQFN (9x9)
Number of I/O: 43
DigiKey Programmable: Not Verified
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R5F52318BGNE#20 rx230-group-rx231-group-datasheet-rev120?r=1054376
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT 512KB FLASH 48HWQFN
Packaging: Tray
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 54MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: RXv2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-HWQFN (7x7)
Number of I/O: 30
DigiKey Programmable: Not Verified
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HZM6.2NB2JTL-E
HZM6.2NB2JTL-E
Виробник: Renesas Electronics America Inc
Description: DIODE ZENER
Packaging: Bulk
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1623+14.84 грн
Мінімальне замовлення: 1623
В кошику  од. на суму  грн.
HZM6.2NB2TL-E RNCCS12280-1.pdf?t.download=true&u=5oefqw
HZM6.2NB2TL-E
Виробник: Renesas Electronics America Inc
Description: DIODE ZENER
Packaging: Bulk
на замовлення 4944 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1623+14.84 грн
Мінімальне замовлення: 1623
В кошику  од. на суму  грн.
HZM6.2NB2JTR-E
HZM6.2NB2JTR-E
Виробник: Renesas Electronics America Inc
Description: DIODE ZENER
Packaging: Bulk
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1623+14.84 грн
Мінімальне замовлення: 1623
В кошику  од. на суму  грн.
XPP526155.520000I
Виробник: Renesas Electronics America Inc
Description: XTAL OSC XO 155.5200MHZ LVPECL
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V
Current - Supply (Max): 94mA
Height - Seated (Max): 0.051" (1.30mm)
Frequency: 155.52 MHz
Base Resonator: Crystal
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XLM336048.000000I xl-family-low-phase-noise-quartz-based-pll-oscillators-datasheet
Виробник: Renesas Electronics America Inc
Description: XTAL OSC XO 48.0000MHZ LVDS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 100mA
Height - Seated (Max): 0.039" (1.00mm)
Frequency: 48 MHz
Base Resonator: Crystal
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XLM336027.000000I xl-family-low-phase-noise-quartz-based-pll-oscillators-datasheet
Виробник: Renesas Electronics America Inc
Description: XTAL OSC XO 27.0000MHZ LVDS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 100mA
Height - Seated (Max): 0.039" (1.00mm)
Frequency: 27 MHz
Base Resonator: Crystal
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