Продукція > SAMTEC INC. > Всі товари виробника SAMTEC INC. (211829) > Сторінка 2947 з 3531
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
CES-122-01-S-S | Samtec Inc. |
Description: CONN RCPT 22POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole Number of Positions: 22 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.128" (3.25mm) Insulation Height: 0.200" (5.08mm) Number of Rows: 1 |
на замовлення 473 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
|
CES-125-02-T-S-RA | Samtec Inc. |
Description: CONN RCPT 25POS 0.1 TIN PCB R/APackaging: Tube Connector Type: Receptacle Mounting Type: Through Hole, Right Angle Number of Positions: 25 Style: Board to Board Operating Temperature: -55°C ~ 105°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Contact Length - Post: 0.120" (3.05mm) Insulation Height: 0.120" (3.05mm) Number of Rows: 1 |
на замовлення 389 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
|
CES-120-01-S-D | Samtec Inc. |
Description: CONN RCPT 40POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole Number of Positions: 40 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.128" (3.25mm) Insulation Height: 0.200" (5.08mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 477 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
| TW-04-04-F-S-250-SM | Samtec Inc. |
Description: FLEXIBLE SURFACE MOUNT BOARD STAPackaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 3.00µin (0.076µm) Number of Rows: 1 Number of Positions: 4 Length - Overall Pin: 0.487" (12.370mm) Length - Post (Mating): 0.237" (6.020mm) Length - Stack Height: 0.250" (6.350mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PCIEC-164-0150-EC-EM-C | Samtec Inc. |
Description: PCI EXPRESS JUMPER CABLE ASSEMBLPackaging: Bulk Connector Type: Receptacle to Card Edge Gender: Female to Male Color: Blue, Gray Number of Positions: 164 Cable Type: Flat, Twin Axial Usage: Internal Fastening Type: Push-Pull Cable Connectors: PCIe x16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| TW-01-01-T-S-201-057 | Samtec Inc. |
Description: CONN BRD STACK 2.00 1POSPackaging: Bulk |
на замовлення 1709 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
|
FFSD-20-D-05.25-01-S-N | Samtec Inc. |
Description: .050 X .050 C.L. FEMALE IDC ASSEPackaging: Bulk Features: Polarizing Key Connector Type: Socket to Socket Contact Finish: Gold Color: Gray, Ribbon Length: 0.437' (133.35mm, 5.25") Shielding: Unshielded Number of Positions: 40 Number of Rows: 2 Contact Finish Thickness: 30.0µin (0.76µm) Cable Termination: IDC Pitch - Cable: 0.025" (0.64mm) Pitch - Connector: 0.050" (1.27mm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| TCSD-13-D-12.00-01-N-R | Samtec Inc. |
Description: 2MM DOUBLE ROW FEMALE IDC ASSEMBPackaging: Bulk Features: Polarizing Key Connector Type: Socket to Socket, Reversed Contact Finish: Gold Color: Gray, Ribbon Length: 1.00' (304.80mm) Shielding: Unshielded Number of Positions: 26 Number of Rows: 2 Contact Finish Thickness: 30.0µin (0.76µm) Cable Termination: IDC Pitch - Cable: 0.039" (1.00mm) Pitch - Connector: 0.079" (2.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| TCSD-13-D-12.00-01-N-RW-R | Samtec Inc. |
Description: 2MM DOUBLE ROW FEMALE IDC ASSEMBPackaging: Bulk Features: Polarizing Key, Reverse Wiring Connector Type: Socket to Socket, Reversed Contact Finish: Gold Color: Gray, Ribbon Length: 1.00' (304.80mm) Shielding: Unshielded Number of Positions: 26 Number of Rows: 2 Contact Finish Thickness: 30.0µin (0.76µm) Cable Termination: IDC Pitch - Cable: 0.039" (1.00mm) Pitch - Connector: 0.079" (2.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| FW-15-05-L-D-520-100 | Samtec Inc. |
Description: CONN HDR 30POS 0.05 STACK SMDPackaging: Bulk Color: Black Mounting Type: Surface Mount Pitch: 0.050" (1.27mm) Row Spacing: 0.050" (1.27mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 30 Length - Overall Pin: 0.620" (15.748mm) Length - Post (Mating): 0.100" (2.540mm) Length - Stack Height: 0.520" (13.208mm) |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
|
SEAMP-20-02.0-L-08-GP | Samtec Inc. |
Description: CONN HD ARRAY M 160POS PRESS-FITPackaging: Tube Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 8 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
|
SEAMP-20-02.0-L-04 | Samtec Inc. |
Description: CONN HD ARRAY M 80POS PRESS-FITPackaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 80 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| SEAMP-20-02.0-L-04-TR | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tape & Reel (TR) Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 80 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 4 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SEAMP-20-02.0-L-04-GP-TR | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tape & Reel (TR) Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 80 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 4 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SEAMP-20-02.0-S-04-TR | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tape & Reel (TR) Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 80 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 4 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SEAMP-20-02.0-L-06-TR | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tape & Reel (TR) Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SEAMP-20-02.0-L-06-GP-TR | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tape & Reel (TR) Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SEAMP-20-02.0-S-06-TR | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tape & Reel (TR) Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
SEAMP-20-02.0-L-06 | Samtec Inc. |
Description: CONN HD ARRAY M 120POS PRESS-FITPackaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
|
SEAMP-20-02.0-L-06 | Samtec Inc. |
Description: CONN HD ARRAY M 120POS PRESS-FITPackaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| SEAMP-20-02.0-L-04-GP | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tube Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 80 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 4 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SEAMP-20-02.0-L-08-GP-TR | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tape & Reel (TR) Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 8 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
SEAMP-20-02.0-S-06 | Samtec Inc. |
Description: CONN HD ARRAY M 120POS PRESS-FITPackaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
SEAMP-20-02.0-L-10-TR | Samtec Inc. |
Description: CONN HD ARRAY PLUG 200P SMD GOLDPackaging: Tape & Reel (TR) Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 10 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| SEAMP-20-02.0-S-08-GP-TR | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tape & Reel (TR) Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 8 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SEAMP-20-02.0-L-06-GP | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tube Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
SEAMP-20-02.0-L-08 | Samtec Inc. |
Description: CONN HD ARRAY M 160POS PRESS-FITPackaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| SEAMP-20-02.0-S-06-GP | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Bulk Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 120 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 6 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
SEAMP-20-02.0-L-10 | Samtec Inc. |
Description: CONN HD ARRAY M 200POS PRESS-FITPackaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 10 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| SEAMP-20-02.0-S-08 | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 8 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
SEAMP-20-02.0-S-08-GP | Samtec Inc. |
Description: CONN HD ARRAY M 160POS PRESS-FITPackaging: Tube Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| SEAMP-20-02.0-L-10-GP | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tube Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 10 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SEAMP-20-02.0-S-10 | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 10 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SEAMP-20-02.0-S-10-GP | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED HIGH-DENPackaging: Tube Features: Board Guide Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Through Hole Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.181" (4.60mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm Number of Rows: 10 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MTLW-103-22-G-S-275 | Samtec Inc. |
Description: CONN HEADER VERT 3POS 2.54MM Packaging: Bulk Connector Type: Header Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 3 Number of Rows: 1 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Contact Shape: Square Contact Length - Post: 0.295" (7.49mm) Insulation Height: 0.060" (1.52mm) Shrouding: Unshrouded Overall Contact Length: 0.630" (16.00mm) Insulation Material: Liquid Crystal Polymer (LCP) Contact Length - Mating: 0.275" (6.99mm) |
на замовлення 1562 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| TCMD-05-S-03.15-01 | Samtec Inc. |
Description: 2MM DOUBLE ROW MALE IDC ASSEMBLY Packaging: Bulk Connector Type: Plug to Cable Contact Finish: Gold Color: Gray, Ribbon Shielding: Unshielded Number of Positions: 10 Number of Rows: 2 Cable Termination: IDC Pitch - Cable: 0.039" (1.00mm) Pitch - Connector: 0.079" (2.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| TSW-115-29-T-D | Samtec Inc. |
Description: CONN HDR .100" 30POSPackaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.910" (23.11mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 1.330" (33.78mm) Insulation Material: Polybutylene Terephthalate (PBT) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.320" (8.13mm) |
на замовлення 393 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| TSW-115-29-T-D | Samtec Inc. |
Description: CONN HDR .100" 30POSPackaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.910" (23.11mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 1.330" (33.78mm) Insulation Material: Polybutylene Terephthalate (PBT) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.320" (8.13mm) |
на замовлення 281 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| MTSW-115-22-G-D-400 | Samtec Inc. |
Description: CONN HEADER VERT 30POS 2.54MMPackaging: Bulk Connector Type: Header, Cuttable Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Contact Shape: Square Contact Length - Post: 0.130" (3.30mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.630" (16.00mm) Insulation Material: Polyester, Glass Filled Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.400" (10.16mm) |
на замовлення 746 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| MTSW-115-22-G-D-400 | Samtec Inc. |
Description: CONN HEADER VERT 30POS 2.54MMPackaging: Bulk Connector Type: Header, Cuttable Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Contact Shape: Square Contact Length - Post: 0.130" (3.30mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.630" (16.00mm) Insulation Material: Polyester, Glass Filled Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.400" (10.16mm) |
на замовлення 533 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| HTSW-115-26-S-D | Samtec Inc. |
Description: CONN HEADER VERT 30POS 2.54MM Packaging: Bulk Connector Type: Header Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.456" (11.58mm) Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
на замовлення 380 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| HTSW-115-26-S-D | Samtec Inc. |
Description: CONN HEADER VERT 30POS 2.54MM Packaging: Bulk Connector Type: Header Current Rating (Amps): Varies by Wire Gauge Mounting Type: Through Hole Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.456" (11.58mm) Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
на замовлення 272 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
|
SSW-115-21-S-D | Samtec Inc. |
Description: CONN RCPT 30POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.7A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.104" (2.64mm) Insulation Height: 0.335" (8.51mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 705 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
| ESW-115-23-T-D | Samtec Inc. |
Description: CONN SOCKET 30POS 0.1 TIN PCBPackaging: Tube Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 105°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Contact Length - Post: 0.190" (4.83mm) Insulation Height: 0.535" (13.60mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 92 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| ESW-115-23-T-D | Samtec Inc. |
Description: CONN SOCKET 30POS 0.1 TIN PCBPackaging: Tube Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 105°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Contact Length - Post: 0.190" (4.83mm) Insulation Height: 0.535" (13.60mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| SSW-115-22-G-D-VS-K-TR | Samtec Inc. |
Description: CONN RCPT 30POS 0.1 GOLD SMDPackaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 4.7A per Contact Mounting Type: Surface Mount Number of Positions: 30 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Insulation Height: 0.335" (8.51mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 69 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| SSW-115-22-G-D-VS-K-TR | Samtec Inc. |
Description: CONN RCPT 30POS 0.1 GOLD SMDPackaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 4.7A per Contact Mounting Type: Surface Mount Number of Positions: 30 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Insulation Height: 0.335" (8.51mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| ESW-115-23-G-D | Samtec Inc. |
Description: CONN SOCKET 30POS 0.1 GOLD PCBPackaging: Tube Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Contact Length - Post: 0.190" (4.83mm) Insulation Height: 0.535" (13.60mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 92 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| ESW-115-23-G-D | Samtec Inc. |
Description: CONN SOCKET 30POS 0.1 GOLD PCBPackaging: Tube Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Contact Length - Post: 0.190" (4.83mm) Insulation Height: 0.535" (13.60mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| ESW-115-23-S-D | Samtec Inc. |
Description: CONN SOCKET 30POS 0.1 GOLD PCBPackaging: Tube Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.190" (4.83mm) Insulation Height: 0.535" (13.60mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 92 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
| ESW-115-23-S-D | Samtec Inc. |
Description: CONN SOCKET 30POS 0.1 GOLD PCBPackaging: Tube Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.190" (4.83mm) Insulation Height: 0.535" (13.60mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||
|
CLP-139-02-L-DH-A-TR | Samtec Inc. |
Description: CONN RCPT 78P 0.05 GOLD SMD R/A Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 78 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.135" (3.43mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
CLP-120-02-LM-DH-A-TR | Samtec Inc. |
Description: CONN RCPT 40P 0.05 GOLD SMD R/A Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 40 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.135" (3.43mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| TW-04-09-L-D-215-SM-A-P-TR | Samtec Inc. |
Description: FLEXIBLE SURFACE MOUNT BOARD STAPackaging: Tape & Reel (TR) Color: Black Mounting Type: Surface Mount Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 8 Length - Overall Pin: 0.388" (9.855mm) Length - Post (Mating): 0.173" (4.394mm) Length - Stack Height: 0.215" (5.461mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MMT-110-01-L-DH-A-TR | Samtec Inc. |
Description: CONN HEADER SMD R/A 20POS 2MM Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Header Current Rating (Amps): 3A Mounting Type: Surface Mount, Right Angle Number of Positions: 20 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.157" (4.00mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.079" (2.00mm) Contact Length - Mating: 0.126" (3.20mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| TSM-105-04-L-DH-A-P | Samtec Inc. |
Description: .100" SURFACE MOUNT TERMINAL STRPackaging: Tube Features: Board Guide, Pick and Place Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 10 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.240" (6.10mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.120" (3.05mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
CLP-150-02-F-DH-A-TR | Samtec Inc. |
Description: CONN RCPT 100P 0.05 GOLD SMD R/A Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Receptacle Voltage Rating: 240VAC, 330VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 100 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.135" (3.43mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
TSM-106-04-T-SH-A-K-TR | Samtec Inc. |
Description: CONN HEADER SMD R/A 6POS 2.54MMPackaging: Tape & Reel (TR) Features: Board Guide, Pick and Place Connector Type: Header Mounting Type: Surface Mount, Right Angle Number of Positions: 6 Number of Rows: 1 Style: Board to Board or Cable Operating Temperature: -55°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.120" (3.05mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Contact Length - Mating: 0.120" (3.05mm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| TSM-105-04-F-SV-A-P-TR | Samtec Inc. |
Description: .100" SURFACE MOUNT TERMINAL STRPackaging: Tape & Reel (TR) Features: Board Guide, Pick and Place Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 5 Number of Rows: 1 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Contact Length - Mating: 0.120" (3.05mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
FTSH-117-01-L-DH-A-TR | Samtec Inc. |
Description: CONN HEADER SMD R/A 34POS 1.27MMPackaging: Tape & Reel (TR) Features: Board Guide Connector Type: Header, Cuttable Current Rating (Amps): 3.4A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 34 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.135" (3.43mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.120" (3.05mm) |
товару немає в наявності |
В кошику од. на суму грн. |
| CES-122-01-S-S |
![]() |
Виробник: Samtec Inc.
Description: CONN RCPT 22POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole
Number of Positions: 22
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.128" (3.25mm)
Insulation Height: 0.200" (5.08mm)
Number of Rows: 1
Description: CONN RCPT 22POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole
Number of Positions: 22
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.128" (3.25mm)
Insulation Height: 0.200" (5.08mm)
Number of Rows: 1
на замовлення 473 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 714.52 грн |
| 25+ | 622.60 грн |
| 50+ | 578.63 грн |
| 100+ | 516.73 грн |
| CES-125-02-T-S-RA |
![]() |
Виробник: Samtec Inc.
Description: CONN RCPT 25POS 0.1 TIN PCB R/A
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 25
Style: Board to Board
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.120" (3.05mm)
Number of Rows: 1
Description: CONN RCPT 25POS 0.1 TIN PCB R/A
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 25
Style: Board to Board
Operating Temperature: -55°C ~ 105°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.120" (3.05mm)
Number of Rows: 1
на замовлення 389 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 513.64 грн |
| 50+ | 403.96 грн |
| 100+ | 342.64 грн |
| CES-120-01-S-D |
![]() |
Виробник: Samtec Inc.
Description: CONN RCPT 40POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.128" (3.25mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 40POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.128" (3.25mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 477 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1054.22 грн |
| 10+ | 937.25 грн |
| 25+ | 885.27 грн |
| 50+ | 800.76 грн |
| 100+ | 630.59 грн |
| TW-04-04-F-S-250-SM |
![]() |
Виробник: Samtec Inc.
Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 3.00µin (0.076µm)
Number of Rows: 1
Number of Positions: 4
Length - Overall Pin: 0.487" (12.370mm)
Length - Post (Mating): 0.237" (6.020mm)
Length - Stack Height: 0.250" (6.350mm)
Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 3.00µin (0.076µm)
Number of Rows: 1
Number of Positions: 4
Length - Overall Pin: 0.487" (12.370mm)
Length - Post (Mating): 0.237" (6.020mm)
Length - Stack Height: 0.250" (6.350mm)
товару немає в наявності
В кошику
од. на суму грн.
| PCIEC-164-0150-EC-EM-C |
![]() |
Виробник: Samtec Inc.
Description: PCI EXPRESS JUMPER CABLE ASSEMBL
Packaging: Bulk
Connector Type: Receptacle to Card Edge
Gender: Female to Male
Color: Blue, Gray
Number of Positions: 164
Cable Type: Flat, Twin Axial
Usage: Internal
Fastening Type: Push-Pull
Cable Connectors: PCIe x16
Description: PCI EXPRESS JUMPER CABLE ASSEMBL
Packaging: Bulk
Connector Type: Receptacle to Card Edge
Gender: Female to Male
Color: Blue, Gray
Number of Positions: 164
Cable Type: Flat, Twin Axial
Usage: Internal
Fastening Type: Push-Pull
Cable Connectors: PCIe x16
товару немає в наявності
В кошику
од. на суму грн.
| TW-01-01-T-S-201-057 |
![]() |
на замовлення 1709 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 29+ | 11.43 грн |
| FFSD-20-D-05.25-01-S-N |
![]() |
Виробник: Samtec Inc.
Description: .050 X .050 C.L. FEMALE IDC ASSE
Packaging: Bulk
Features: Polarizing Key
Connector Type: Socket to Socket
Contact Finish: Gold
Color: Gray, Ribbon
Length: 0.437' (133.35mm, 5.25")
Shielding: Unshielded
Number of Positions: 40
Number of Rows: 2
Contact Finish Thickness: 30.0µin (0.76µm)
Cable Termination: IDC
Pitch - Cable: 0.025" (0.64mm)
Pitch - Connector: 0.050" (1.27mm)
Description: .050 X .050 C.L. FEMALE IDC ASSE
Packaging: Bulk
Features: Polarizing Key
Connector Type: Socket to Socket
Contact Finish: Gold
Color: Gray, Ribbon
Length: 0.437' (133.35mm, 5.25")
Shielding: Unshielded
Number of Positions: 40
Number of Rows: 2
Contact Finish Thickness: 30.0µin (0.76µm)
Cable Termination: IDC
Pitch - Cable: 0.025" (0.64mm)
Pitch - Connector: 0.050" (1.27mm)
товару немає в наявності
В кошику
од. на суму грн.
| TCSD-13-D-12.00-01-N-R |
![]() |
Виробник: Samtec Inc.
Description: 2MM DOUBLE ROW FEMALE IDC ASSEMB
Packaging: Bulk
Features: Polarizing Key
Connector Type: Socket to Socket, Reversed
Contact Finish: Gold
Color: Gray, Ribbon
Length: 1.00' (304.80mm)
Shielding: Unshielded
Number of Positions: 26
Number of Rows: 2
Contact Finish Thickness: 30.0µin (0.76µm)
Cable Termination: IDC
Pitch - Cable: 0.039" (1.00mm)
Pitch - Connector: 0.079" (2.00mm)
Description: 2MM DOUBLE ROW FEMALE IDC ASSEMB
Packaging: Bulk
Features: Polarizing Key
Connector Type: Socket to Socket, Reversed
Contact Finish: Gold
Color: Gray, Ribbon
Length: 1.00' (304.80mm)
Shielding: Unshielded
Number of Positions: 26
Number of Rows: 2
Contact Finish Thickness: 30.0µin (0.76µm)
Cable Termination: IDC
Pitch - Cable: 0.039" (1.00mm)
Pitch - Connector: 0.079" (2.00mm)
товару немає в наявності
В кошику
од. на суму грн.
| TCSD-13-D-12.00-01-N-RW-R |
![]() |
Виробник: Samtec Inc.
Description: 2MM DOUBLE ROW FEMALE IDC ASSEMB
Packaging: Bulk
Features: Polarizing Key, Reverse Wiring
Connector Type: Socket to Socket, Reversed
Contact Finish: Gold
Color: Gray, Ribbon
Length: 1.00' (304.80mm)
Shielding: Unshielded
Number of Positions: 26
Number of Rows: 2
Contact Finish Thickness: 30.0µin (0.76µm)
Cable Termination: IDC
Pitch - Cable: 0.039" (1.00mm)
Pitch - Connector: 0.079" (2.00mm)
Description: 2MM DOUBLE ROW FEMALE IDC ASSEMB
Packaging: Bulk
Features: Polarizing Key, Reverse Wiring
Connector Type: Socket to Socket, Reversed
Contact Finish: Gold
Color: Gray, Ribbon
Length: 1.00' (304.80mm)
Shielding: Unshielded
Number of Positions: 26
Number of Rows: 2
Contact Finish Thickness: 30.0µin (0.76µm)
Cable Termination: IDC
Pitch - Cable: 0.039" (1.00mm)
Pitch - Connector: 0.079" (2.00mm)
товару немає в наявності
В кошику
од. на суму грн.
| FW-15-05-L-D-520-100 |
![]() |
Виробник: Samtec Inc.
Description: CONN HDR 30POS 0.05 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.620" (15.748mm)
Length - Post (Mating): 0.100" (2.540mm)
Length - Stack Height: 0.520" (13.208mm)
Description: CONN HDR 30POS 0.05 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.620" (15.748mm)
Length - Post (Mating): 0.100" (2.540mm)
Length - Stack Height: 0.520" (13.208mm)
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 30+ | 537.62 грн |
| SEAMP-20-02.0-L-08-GP |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Description: CONN HD ARRAY M 160POS PRESS-FIT
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1335.13 грн |
| SEAMP-20-02.0-L-04 |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 80POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
Description: CONN HD ARRAY M 80POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-04-TR |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-04-GP-TR |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-S-04-TR |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-06-TR |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-06-GP-TR |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-S-06-TR |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-06 |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 120POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Description: CONN HD ARRAY M 120POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
на замовлення 11 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| SEAMP-20-02.0-L-06 |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 120POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Description: CONN HD ARRAY M 120POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-04-GP |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 80
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 4
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-08-GP-TR |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-S-06 |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 120POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Description: CONN HD ARRAY M 120POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-10-TR |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY PLUG 200P SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Description: CONN HD ARRAY PLUG 200P SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-S-08-GP-TR |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-06-GP |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-08 |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Description: CONN HD ARRAY M 160POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-S-06-GP |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Bulk
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Bulk
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 120
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 6
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-10 |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 200POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Description: CONN HD ARRAY M 200POS PRESS-FIT
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-S-08 |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-S-08-GP |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
Description: CONN HD ARRAY M 160POS PRESS-FIT
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 8
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-10-GP |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-S-10 |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tray
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-S-10-GP |
![]() |
Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
Description: .050" SEARAY HIGH-SPEED HIGH-DEN
Packaging: Tube
Features: Board Guide
Connector Type: High Density Array, Male
Contact Finish: Gold
Mounting Type: Through Hole
Number of Positions: 200
Pitch: 0.050" (1.27mm)
Height Above Board: 0.181" (4.60mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Number of Rows: 10
товару немає в наявності
В кошику
од. на суму грн.
| MTLW-103-22-G-S-275 |
Виробник: Samtec Inc.
Description: CONN HEADER VERT 3POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 3
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.295" (7.49mm)
Insulation Height: 0.060" (1.52mm)
Shrouding: Unshrouded
Overall Contact Length: 0.630" (16.00mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.275" (6.99mm)
Description: CONN HEADER VERT 3POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 3
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.295" (7.49mm)
Insulation Height: 0.060" (1.52mm)
Shrouding: Unshrouded
Overall Contact Length: 0.630" (16.00mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.275" (6.99mm)
на замовлення 1562 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 65.33 грн |
| TCMD-05-S-03.15-01 |
Виробник: Samtec Inc.
Description: 2MM DOUBLE ROW MALE IDC ASSEMBLY
Packaging: Bulk
Connector Type: Plug to Cable
Contact Finish: Gold
Color: Gray, Ribbon
Shielding: Unshielded
Number of Positions: 10
Number of Rows: 2
Cable Termination: IDC
Pitch - Cable: 0.039" (1.00mm)
Pitch - Connector: 0.079" (2.00mm)
Description: 2MM DOUBLE ROW MALE IDC ASSEMBLY
Packaging: Bulk
Connector Type: Plug to Cable
Contact Finish: Gold
Color: Gray, Ribbon
Shielding: Unshielded
Number of Positions: 10
Number of Rows: 2
Cable Termination: IDC
Pitch - Cable: 0.039" (1.00mm)
Pitch - Connector: 0.079" (2.00mm)
товару немає в наявності
В кошику
од. на суму грн.
| TSW-115-29-T-D |
![]() |
Виробник: Samtec Inc.
Description: CONN HDR .100" 30POS
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.910" (23.11mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 1.330" (33.78mm)
Insulation Material: Polybutylene Terephthalate (PBT)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
Description: CONN HDR .100" 30POS
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.910" (23.11mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 1.330" (33.78mm)
Insulation Material: Polybutylene Terephthalate (PBT)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
на замовлення 393 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 331.54 грн |
| 50+ | 277.31 грн |
| 100+ | 241.32 грн |
| TSW-115-29-T-D |
![]() |
Виробник: Samtec Inc.
Description: CONN HDR .100" 30POS
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.910" (23.11mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 1.330" (33.78mm)
Insulation Material: Polybutylene Terephthalate (PBT)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
Description: CONN HDR .100" 30POS
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.910" (23.11mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 1.330" (33.78mm)
Insulation Material: Polybutylene Terephthalate (PBT)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
на замовлення 281 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 182.10 грн |
| MTSW-115-22-G-D-400 |
![]() |
Виробник: Samtec Inc.
Description: CONN HEADER VERT 30POS 2.54MM
Packaging: Bulk
Connector Type: Header, Cuttable
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.130" (3.30mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.630" (16.00mm)
Insulation Material: Polyester, Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.400" (10.16mm)
Description: CONN HEADER VERT 30POS 2.54MM
Packaging: Bulk
Connector Type: Header, Cuttable
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.130" (3.30mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.630" (16.00mm)
Insulation Material: Polyester, Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.400" (10.16mm)
на замовлення 746 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 498.94 грн |
| 25+ | 434.63 грн |
| 50+ | 403.96 грн |
| 100+ | 360.34 грн |
| 500+ | 277.76 грн |
| MTSW-115-22-G-D-400 |
![]() |
Виробник: Samtec Inc.
Description: CONN HEADER VERT 30POS 2.54MM
Packaging: Bulk
Connector Type: Header, Cuttable
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.130" (3.30mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.630" (16.00mm)
Insulation Material: Polyester, Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.400" (10.16mm)
Description: CONN HEADER VERT 30POS 2.54MM
Packaging: Bulk
Connector Type: Header, Cuttable
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.130" (3.30mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.630" (16.00mm)
Insulation Material: Polyester, Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.400" (10.16mm)
на замовлення 533 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 274.38 грн |
| HTSW-115-26-S-D |
Виробник: Samtec Inc.
Description: CONN HEADER VERT 30POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.456" (11.58mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER VERT 30POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.456" (11.58mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
на замовлення 380 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 863.14 грн |
| 25+ | 750.62 грн |
| 50+ | 698.61 грн |
| 100+ | 624.34 грн |
| HTSW-115-26-S-D |
Виробник: Samtec Inc.
Description: CONN HEADER VERT 30POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.456" (11.58mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER VERT 30POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Through Hole
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.456" (11.58mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
на замовлення 272 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 474.44 грн |
| SSW-115-21-S-D |
![]() |
Виробник: Samtec Inc.
Description: CONN RCPT 30POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.7A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.104" (2.64mm)
Insulation Height: 0.335" (8.51mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 30POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.7A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.104" (2.64mm)
Insulation Height: 0.335" (8.51mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 705 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 653.28 грн |
| 25+ | 614.64 грн |
| 50+ | 601.29 грн |
| 100+ | 536.76 грн |
| 500+ | 400.38 грн |
| ESW-115-23-T-D |
![]() |
Виробник: Samtec Inc.
Description: CONN SOCKET 30POS 0.1 TIN PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 105°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SOCKET 30POS 0.1 TIN PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 105°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 92 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 506.29 грн |
| 25+ | 441.27 грн |
| 50+ | 409.30 грн |
| ESW-115-23-T-D |
![]() |
Виробник: Samtec Inc.
Description: CONN SOCKET 30POS 0.1 TIN PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 105°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SOCKET 30POS 0.1 TIN PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 105°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 66 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 14+ | 380.59 грн |
| SSW-115-22-G-D-VS-K-TR |
![]() |
Виробник: Samtec Inc.
Description: CONN RCPT 30POS 0.1 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 4.7A per Contact
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Insulation Height: 0.335" (8.51mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 30POS 0.1 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 4.7A per Contact
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Insulation Height: 0.335" (8.51mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 69 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 925.20 грн |
| 10+ | 873.24 грн |
| 25+ | 854.57 грн |
| 50+ | 773.23 грн |
| SSW-115-22-G-D-VS-K-TR |
![]() |
Виробник: Samtec Inc.
Description: CONN RCPT 30POS 0.1 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 4.7A per Contact
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Insulation Height: 0.335" (8.51mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 30POS 0.1 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 4.7A per Contact
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Insulation Height: 0.335" (8.51mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| ESW-115-23-G-D |
![]() |
Виробник: Samtec Inc.
Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 92 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 934.18 грн |
| 25+ | 814.60 грн |
| 50+ | 755.93 грн |
| ESW-115-23-G-D |
![]() |
Виробник: Samtec Inc.
Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 66 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 14+ | 641.61 грн |
| ESW-115-23-S-D |
![]() |
Виробник: Samtec Inc.
Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 92 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 975.01 грн |
| 25+ | 847.94 грн |
| 50+ | 787.92 грн |
| ESW-115-23-S-D |
![]() |
Виробник: Samtec Inc.
Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN SOCKET 30POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 66 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 14+ | 668.62 грн |
| CLP-139-02-L-DH-A-TR |
Виробник: Samtec Inc.
Description: CONN RCPT 78P 0.05 GOLD SMD R/A
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 78
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.135" (3.43mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 78P 0.05 GOLD SMD R/A
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 78
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.135" (3.43mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| CLP-120-02-LM-DH-A-TR |
Виробник: Samtec Inc.
Description: CONN RCPT 40P 0.05 GOLD SMD R/A
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 40
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.135" (3.43mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 40P 0.05 GOLD SMD R/A
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 40
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.135" (3.43mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| TW-04-09-L-D-215-SM-A-P-TR |
![]() |
Виробник: Samtec Inc.
Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 8
Length - Overall Pin: 0.388" (9.855mm)
Length - Post (Mating): 0.173" (4.394mm)
Length - Stack Height: 0.215" (5.461mm)
Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 8
Length - Overall Pin: 0.388" (9.855mm)
Length - Post (Mating): 0.173" (4.394mm)
Length - Stack Height: 0.215" (5.461mm)
товару немає в наявності
В кошику
од. на суму грн.
| MMT-110-01-L-DH-A-TR |
Виробник: Samtec Inc.
Description: CONN HEADER SMD R/A 20POS 2MM
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.157" (4.00mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.126" (3.20mm)
Description: CONN HEADER SMD R/A 20POS 2MM
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.157" (4.00mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.126" (3.20mm)
товару немає в наявності
В кошику
од. на суму грн.
| TSM-105-04-L-DH-A-P |
![]() |
Виробник: Samtec Inc.
Description: .100" SURFACE MOUNT TERMINAL STR
Packaging: Tube
Features: Board Guide, Pick and Place
Connector Type: Header
Mounting Type: Surface Mount, Right Angle
Number of Positions: 10
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.240" (6.10mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.120" (3.05mm)
Description: .100" SURFACE MOUNT TERMINAL STR
Packaging: Tube
Features: Board Guide, Pick and Place
Connector Type: Header
Mounting Type: Surface Mount, Right Angle
Number of Positions: 10
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.240" (6.10mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.120" (3.05mm)
товару немає в наявності
В кошику
од. на суму грн.
| CLP-150-02-F-DH-A-TR |
Виробник: Samtec Inc.
Description: CONN RCPT 100P 0.05 GOLD SMD R/A
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 100
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.135" (3.43mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN RCPT 100P 0.05 GOLD SMD R/A
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Voltage Rating: 240VAC, 330VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 100
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.135" (3.43mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| TSM-106-04-T-SH-A-K-TR |
![]() |
Виробник: Samtec Inc.
Description: CONN HEADER SMD R/A 6POS 2.54MM
Packaging: Tape & Reel (TR)
Features: Board Guide, Pick and Place
Connector Type: Header
Mounting Type: Surface Mount, Right Angle
Number of Positions: 6
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.120" (3.05mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.120" (3.05mm)
Description: CONN HEADER SMD R/A 6POS 2.54MM
Packaging: Tape & Reel (TR)
Features: Board Guide, Pick and Place
Connector Type: Header
Mounting Type: Surface Mount, Right Angle
Number of Positions: 6
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.120" (3.05mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.120" (3.05mm)
товару немає в наявності
В кошику
од. на суму грн.
| TSM-105-04-F-SV-A-P-TR |
![]() |
Виробник: Samtec Inc.
Description: .100" SURFACE MOUNT TERMINAL STR
Packaging: Tape & Reel (TR)
Features: Board Guide, Pick and Place
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 5
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.120" (3.05mm)
Description: .100" SURFACE MOUNT TERMINAL STR
Packaging: Tape & Reel (TR)
Features: Board Guide, Pick and Place
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 5
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.120" (3.05mm)
товару немає в наявності
В кошику
од. на суму грн.
| FTSH-117-01-L-DH-A-TR |
![]() |
Виробник: Samtec Inc.
Description: CONN HEADER SMD R/A 34POS 1.27MM
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Header, Cuttable
Current Rating (Amps): 3.4A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 34
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.135" (3.43mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
Description: CONN HEADER SMD R/A 34POS 1.27MM
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Header, Cuttable
Current Rating (Amps): 3.4A per Contact
Mounting Type: Surface Mount, Right Angle
Number of Positions: 34
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.135" (3.43mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
товару немає в наявності
В кошику
од. на суму грн.









