Продукція > SAMTEC INC. > Всі товари виробника SAMTEC INC. (214148) > Сторінка 3100 з 3570
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| DW-08-09-F-D-466 | Samtec Inc. | Description: FLEXIBLE BOARD STACKING HEADER W |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| DW-05-10-G-D-466 | Samtec Inc. | Description: FLEXIBLE BOARD STACKING HEADER W |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| DW-05-11-L-D-466 | Samtec Inc. | Description: FLEXIBLE BOARD STACKING HEADER W |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| DW-05-10-LM-D-466 | Samtec Inc. | Description: FLEXIBLE BOARD STACKING HEADER W |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| DW-18-09-S-D-466 | Samtec Inc. | Description: FLEXIBLE BOARD STACKING HEADER W |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| DW-14-11-F-D-466 | Samtec Inc. | Description: FLEXIBLE BOARD STACKING HEADER W |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| TW-06-06-T-D-446-140 | Samtec Inc. |
Description: CONN BRD STACK 2.00 12POSPackaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Tin Number of Rows: 2 Number of Positions: 12 Length - Overall Pin: 0.673" (17.094mm) Length - Post (Mating): 0.087" (2.210mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.140" (3.556mm) |
на замовлення 243 шт: термін постачання 21-31 дні (днів) |
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| TW-06-06-T-D-446-140 | Samtec Inc. |
Description: CONN BRD STACK 2.00 12POSPackaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Tin Number of Rows: 2 Number of Positions: 12 Length - Overall Pin: 0.673" (17.094mm) Length - Post (Mating): 0.087" (2.210mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.140" (3.556mm) |
на замовлення 403 шт: термін постачання 21-31 дні (днів) |
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| ZW-10-09-G-D-446-158 | Samtec Inc. |
Description: CONN BRD STACK .100" 20POSPackaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 20 Length - Overall Pin: 0.730" (18.542mm) Length - Post (Mating): 0.126" (3.200mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.158" (4.013mm) |
на замовлення 738 шт: термін постачання 21-31 дні (днів) |
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| ZW-10-09-G-D-446-158 | Samtec Inc. |
Description: CONN BRD STACK .100" 20POSPackaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 20 Length - Overall Pin: 0.730" (18.542mm) Length - Post (Mating): 0.126" (3.200mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.158" (4.013mm) |
на замовлення 1225 шт: термін постачання 21-31 дні (днів) |
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| ZW-14-09-G-D-446-158 | Samtec Inc. |
Description: CONN BRD STACK .100" 28POSPackaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 28 Length - Overall Pin: 0.730" (18.542mm) Length - Post (Mating): 0.126" (3.200mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.158" (4.013mm) |
на замовлення 442 шт: термін постачання 21-31 дні (днів) |
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| ZW-14-09-G-D-446-158 | Samtec Inc. |
Description: CONN BRD STACK .100" 28POSPackaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 28 Length - Overall Pin: 0.730" (18.542mm) Length - Post (Mating): 0.126" (3.200mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.158" (4.013mm) |
на замовлення 734 шт: термін постачання 21-31 дні (днів) |
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| HW-05-15-G-D-446-SM-A | Samtec Inc. |
Description: CONN HDR 10POS 0.1 STACK SMDPackaging: Bulk Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 10 Length - Overall Pin: 0.565" (14.351mm) Length - Post (Mating): 0.119" (3.023mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 274 шт: термін постачання 21-31 дні (днів) |
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| HW-05-15-G-D-446-SM-A | Samtec Inc. |
Description: CONN HDR 10POS 0.1 STACK SMDPackaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 10 Length - Overall Pin: 0.565" (14.351mm) Length - Post (Mating): 0.119" (3.023mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 165 шт: термін постачання 21-31 дні (днів) |
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| ZW-15-10-S-D-446-150 | Samtec Inc. |
Description: CONN BRD STACK .100" 30POSPackaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 30 Length - Overall Pin: 0.830" (21.082mm) Length - Post (Mating): 0.234" (5.944mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.150" (3.810mm) |
на замовлення 442 шт: термін постачання 21-31 дні (днів) |
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| TW-25-06-S-D-446-090 | Samtec Inc. |
Description: CONN BRD STACK 2.00 50POSPackaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.673" (17.094mm) Length - Post (Mating): 0.137" (3.480mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.090" (2.286mm) |
на замовлення 182 шт: термін постачання 21-31 дні (днів) |
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| TW-25-06-S-D-446-090 | Samtec Inc. |
Description: CONN BRD STACK 2.00 50POSPackaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.673" (17.094mm) Length - Post (Mating): 0.137" (3.480mm) Length - Stack Height: 0.446" (11.328mm) Length - Tail: 0.090" (2.286mm) |
на замовлення 302 шт: термін постачання 21-31 дні (днів) |
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| HW-07-15-G-D-446-SM-A | Samtec Inc. |
Description: CONN HDR 14POS 0.1 STACK SMDPackaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 14 Length - Overall Pin: 0.565" (14.351mm) Length - Post (Mating): 0.119" (3.023mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 135 шт: термін постачання 21-31 дні (днів) |
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| HW-07-15-G-D-446-SM-A | Samtec Inc. |
Description: CONN HDR 14POS 0.1 STACK SMDPackaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 14 Length - Overall Pin: 0.565" (14.351mm) Length - Post (Mating): 0.119" (3.023mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 224 шт: термін постачання 21-31 дні (днів) |
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| HW-13-09-G-D-446-SM | Samtec Inc. |
Description: CONN HDR 26POS 0.1 STACK SMDPackaging: Bulk Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 26 Length - Overall Pin: 0.665" (16.891mm) Length - Post (Mating): 0.219" (5.563mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 166 шт: термін постачання 21-31 дні (днів) |
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| MTMM-128-11-G-D-446 | Samtec Inc. |
Description: 2MM TERMINAL STRIPPackaging: Bulk |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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| MTMM-128-11-G-D-446 | Samtec Inc. |
Description: 2MM TERMINAL STRIPPackaging: Bulk |
на замовлення 149 шт: термін постачання 21-31 дні (днів) |
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| HW-36-09-G-D-446-SM | Samtec Inc. |
Description: CONN HDR 72POS 0.1 STACK SMDPackaging: Bulk Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 72 Length - Overall Pin: 0.665" (16.891mm) Length - Post (Mating): 0.219" (5.563mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 73 шт: термін постачання 21-31 дні (днів) |
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| HW-36-09-G-D-446-SM | Samtec Inc. |
Description: CONN HDR 72POS 0.1 STACK SMDPackaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Number of Rows: 2 Number of Positions: 72 Length - Overall Pin: 0.665" (16.891mm) Length - Post (Mating): 0.219" (5.563mm) Length - Stack Height: 0.446" (11.328mm) |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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| HSEC8-110-01-S-DV-A-WT-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-113-01-SM-DV-A-L2-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 26 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 13 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-110-03-S-DV-A-WT-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-109-01-S-DV-A-L2-K | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Latches Packaging: Bulk Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 18 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 9 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-110-01-SM-DV-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-170-03-L-DV-A-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 140 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30; 40 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-130-03-L-DV-A-WT-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-110-01-S-DV-A-GR-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-120-01-2-DP-A-K | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 20.0µin (0.51µm) Contact Material: Copper Alloy Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-110-01-H-DV-A-WT-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Pick and Place, Solder Retention Packaging: Bulk Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 10 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-137-01-L-DV-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 74 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 15; 20 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-109-01-S-DV-A-BL-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Board Lock Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 18 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 4; 5 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-120-03-S-DV-A-WT-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 20 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-140-01-L-DV-A-GR-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 80 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 18; 22 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-140-03-S-DV-A-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 80 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 18; 22 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-120-01-SM-DV-A-WT | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Solder Retention Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 20 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-113-01-H-DV-A-BL-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Board Lock Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 26 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 6; 7 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-112-01-L-DP-A-WT-K | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Copper Alloy Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-109-01-L-RA-BL-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Lock Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount, Right Angle Number of Positions: 18 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 4; 5 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-116-01-L-DP-A-WT-K | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Pick and Place, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 32 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Copper Alloy Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-160-01-L-DV-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALPackaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 120 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 28; 32 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-130-03-H-DV-A | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.093" (2.36mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-130-01-SM-DV-A-BL-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Board Lock, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-170-01-S-DV-A-WT-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 140 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30; 40 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-109-01-S-RA-BL-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Lock Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount, Right Angle Number of Positions: 18 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 4; 5 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| HSEC8-130-01-S-DV-A-GR-K-TR | Samtec Inc. |
Description: 0.80 MM HIGH-SPEED POWER/SIGNALFeatures: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: PCI Express™ Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| S2SD-15-24-L-12.00-SR | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DISPackaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Black, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
S2SD-15-24-L-20.00-SR | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DISPackaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Black, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
S2SD-15-24-L-06.00-DR-NDX | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DISPackaging: Bulk Connector Type: Socket to Socket Contact Finish: Gold Color: Black, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| S2SD-15-24C-L-20.00-SR | Samtec Inc. |
Description: 2.00 MM TIGER EYE DOUBLE ROW DISPackaging: Bulk Connector Type: Socket to Individual Wire Leads Contact Finish: Gold Color: Multiple, Individual Shielding: Unshielded Number of Positions: 30 Number of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Cable Termination: Crimp Pitch - Connector: 0.079" (2.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
|
ERM8-050-01-S-D-EM2-L-TR | Samtec Inc. |
Description: CONN HDR 100POS EDGE MNT GOLDFeatures: Latches Packaging: Tape & Reel (TR) Connector Type: Header, Center Strip Contacts Contact Finish: Gold Mounting Type: Board Edge, Straddle Mount Number of Positions: 100 Pitch: 0.031" (0.80mm) Contact Finish Thickness: 30.0µin (0.76µm) Number of Rows: 2 |
на замовлення 125 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
|
|
ERM8-050-01-S-D-EM2-L-TR | Samtec Inc. |
Description: CONN HDR 100POS EDGE MNT GOLDFeatures: Latches Packaging: Cut Tape (CT) Connector Type: Header, Center Strip Contacts Contact Finish: Gold Mounting Type: Board Edge, Straddle Mount Number of Positions: 100 Pitch: 0.031" (0.80mm) Contact Finish Thickness: 30.0µin (0.76µm) Number of Rows: 2 |
на замовлення 195 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
|
HW-06-17-T-S-350-SM-TR | Samtec Inc. |
Description: CONN HDR 6POS 0.1 STACK SMD TINPackaging: Tape & Reel (TR) Color: Black Mounting Type: Surface Mount Pitch: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Tin Number of Rows: 1 Number of Positions: 6 Length - Overall Pin: 0.415" (10.541mm) Length - Post (Mating): 0.065" (1.651mm) Length - Stack Height: 0.350" (8.890mm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| FTS-114-03-L-S | Samtec Inc. |
Description: CONN HEADER VERT 14POS 1.27MM Packaging: Tube Connector Type: Header, Cuttable Current Rating (Amps): 3.4A per Contact Mounting Type: Through Hole Number of Positions: 14 Number of Rows: 1 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.090" (2.29mm) Insulation Height: 0.034" (0.86mm) Shrouding: Unshrouded Overall Contact Length: 0.189" (4.80mm) Insulation Material: Liquid Crystal Polymer (LCP) Contact Length - Mating: 0.065" (1.65mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| FTS-114-03-L-SV | Samtec Inc. |
Description: CONN HEADER SMD 14POS 1.27MM Packaging: Tube Connector Type: Header, Cuttable Current Rating (Amps): 3.4A per Contact Mounting Type: Surface Mount Number of Positions: 14 Number of Rows: 1 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.034" (0.86mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Contact Length - Mating: 0.065" (1.65mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| TW-25-03-S-D-380-SM-A-P-TR | Samtec Inc. |
Description: FLEXIBLE SURFACE MOUNT BOARD STAPackaging: Tape & Reel (TR) Color: Black Mounting Type: Surface Mount Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.467" (11.862mm) Length - Post (Mating): 0.087" (2.210mm) Length - Stack Height: 0.380" (9.652mm) |
товару немає в наявності |
В кошику од. на суму грн. |
| DW-08-09-F-D-466 |
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику
од. на суму грн.
| DW-05-10-G-D-466 |
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику
од. на суму грн.
| DW-05-11-L-D-466 |
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику
од. на суму грн.
| DW-05-10-LM-D-466 |
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику
од. на суму грн.
| DW-18-09-S-D-466 |
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику
од. на суму грн.
| DW-14-11-F-D-466 |
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику
од. на суму грн.
| TW-06-06-T-D-446-140 |
![]() |
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 12POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 2
Number of Positions: 12
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.140" (3.556mm)
Description: CONN BRD STACK 2.00 12POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 2
Number of Positions: 12
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.140" (3.556mm)
на замовлення 243 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 141.08 грн |
| TW-06-06-T-D-446-140 |
![]() |
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 12POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 2
Number of Positions: 12
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.140" (3.556mm)
Description: CONN BRD STACK 2.00 12POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 2
Number of Positions: 12
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.140" (3.556mm)
на замовлення 403 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 256.13 грн |
| 50+ | 191.40 грн |
| 100+ | 154.69 грн |
| ZW-10-09-G-D-446-158 |
![]() |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 738 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 267.05 грн |
| ZW-10-09-G-D-446-158 |
![]() |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 1225 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 486.23 грн |
| 50+ | 381.49 грн |
| 100+ | 323.80 грн |
| 500+ | 270.66 грн |
| 1000+ | 210.37 грн |
| ZW-14-09-G-D-446-158 |
![]() |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 442 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 288.04 грн |
| ZW-14-09-G-D-446-158 |
![]() |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 734 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 524.02 грн |
| 25+ | 456.19 грн |
| 50+ | 423.44 грн |
| 100+ | 378.92 грн |
| 500+ | 295.26 грн |
| HW-05-15-G-D-446-SM-A |
![]() |
Виробник: Samtec Inc.
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 274 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 377.06 грн |
| 50+ | 296.27 грн |
| 100+ | 251.70 грн |
| HW-05-15-G-D-446-SM-A |
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Виробник: Samtec Inc.
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 165 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 43+ | 207.41 грн |
| ZW-15-10-S-D-446-150 |
![]() |
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.830" (21.082mm)
Length - Post (Mating): 0.234" (5.944mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.150" (3.810mm)
Description: CONN BRD STACK .100" 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.830" (21.082mm)
Length - Post (Mating): 0.234" (5.944mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.150" (3.810mm)
на замовлення 442 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 419.05 грн |
| TW-25-06-S-D-446-090 |
![]() |
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
на замовлення 182 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 949.79 грн |
| TW-25-06-S-D-446-090 |
![]() |
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
на замовлення 302 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1725.75 грн |
| 10+ | 1574.41 грн |
| 25+ | 1515.43 грн |
| 50+ | 1387.73 грн |
| 100+ | 1034.65 грн |
| HW-07-15-G-D-446-SM-A |
![]() |
Виробник: Samtec Inc.
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 135 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 32+ | 274.03 грн |
| HW-07-15-G-D-446-SM-A |
![]() |
Виробник: Samtec Inc.
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 224 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 497.99 грн |
| 50+ | 391.97 грн |
| 100+ | 332.98 грн |
| HW-13-09-G-D-446-SM |
![]() |
Виробник: Samtec Inc.
Description: CONN HDR 26POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 26
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 26POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 26
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 166 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 634.03 грн |
| 25+ | 551.91 грн |
| 50+ | 513.88 грн |
| 100+ | 458.89 грн |
| MTMM-128-11-G-D-446 |
![]() |
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 814.59 грн |
| MTMM-128-11-G-D-446 |
![]() |
на замовлення 149 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1481.37 грн |
| 10+ | 1318.79 грн |
| 25+ | 1246.69 грн |
| 50+ | 1126.92 грн |
| 100+ | 831.66 грн |
| HW-36-09-G-D-446-SM |
![]() |
Виробник: Samtec Inc.
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 73 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1668.64 грн |
| 10+ | 1485.30 грн |
| 25+ | 1404.02 грн |
| 50+ | 1270.86 грн |
| HW-36-09-G-D-446-SM |
![]() |
Виробник: Samtec Inc.
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 44 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 918.02 грн |
| HSEC8-110-01-S-DV-A-WT-TR |
![]() |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-113-01-SM-DV-A-L2-K-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 13
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 13
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-110-03-S-DV-A-WT-TR |
![]() |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-109-01-S-DV-A-L2-K |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Latches
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 9
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Latches
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 9
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-110-01-SM-DV-K-TR |
![]() |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-170-03-L-DV-A-TR |
![]() |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-130-03-L-DV-A-WT-K-TR |
![]() |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-110-01-S-DV-A-GR-K-TR |
![]() |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-120-01-2-DP-A-K |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-110-01-H-DV-A-WT-K-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-137-01-L-DV-K-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 74
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 15; 20
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 74
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 15; 20
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-109-01-S-DV-A-BL-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-120-03-S-DV-A-WT-K-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-140-01-L-DV-A-GR-K-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-140-03-S-DV-A-TR |
![]() |
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-120-01-SM-DV-A-WT |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-113-01-H-DV-A-BL-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 6; 7
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 6; 7
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-112-01-L-DP-A-WT-K |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-109-01-L-RA-BL-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-116-01-L-DP-A-WT-K |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-160-01-L-DV-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 120
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 28; 32
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 120
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 28; 32
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-130-03-H-DV-A |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-130-01-SM-DV-A-BL-K-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-170-01-S-DV-A-WT-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-109-01-S-RA-BL-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| HSEC8-130-01-S-DV-A-GR-K-TR |
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Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
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| S2SD-15-24-L-12.00-SR |
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Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
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| S2SD-15-24-L-20.00-SR |
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Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
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| S2SD-15-24-L-06.00-DR-NDX |
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Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Socket
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Socket
Contact Finish: Gold
Color: Black, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
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| S2SD-15-24C-L-20.00-SR |
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Виробник: Samtec Inc.
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Multiple, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
Description: 2.00 MM TIGER EYE DOUBLE ROW DIS
Packaging: Bulk
Connector Type: Socket to Individual Wire Leads
Contact Finish: Gold
Color: Multiple, Individual
Shielding: Unshielded
Number of Positions: 30
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Cable Termination: Crimp
Pitch - Connector: 0.079" (2.00mm)
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| ERM8-050-01-S-D-EM2-L-TR |
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Виробник: Samtec Inc.
Description: CONN HDR 100POS EDGE MNT GOLD
Features: Latches
Packaging: Tape & Reel (TR)
Connector Type: Header, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Board Edge, Straddle Mount
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
Description: CONN HDR 100POS EDGE MNT GOLD
Features: Latches
Packaging: Tape & Reel (TR)
Connector Type: Header, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Board Edge, Straddle Mount
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
на замовлення 125 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 125+ | 479.56 грн |
| ERM8-050-01-S-D-EM2-L-TR |
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Виробник: Samtec Inc.
Description: CONN HDR 100POS EDGE MNT GOLD
Features: Latches
Packaging: Cut Tape (CT)
Connector Type: Header, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Board Edge, Straddle Mount
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
Description: CONN HDR 100POS EDGE MNT GOLD
Features: Latches
Packaging: Cut Tape (CT)
Connector Type: Header, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Board Edge, Straddle Mount
Number of Positions: 100
Pitch: 0.031" (0.80mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
на замовлення 195 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 654.19 грн |
| 10+ | 569.47 грн |
| 25+ | 538.32 грн |
| 50+ | 489.53 грн |
| HW-06-17-T-S-350-SM-TR |
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Виробник: Samtec Inc.
Description: CONN HDR 6POS 0.1 STACK SMD TIN
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 1
Number of Positions: 6
Length - Overall Pin: 0.415" (10.541mm)
Length - Post (Mating): 0.065" (1.651mm)
Length - Stack Height: 0.350" (8.890mm)
Description: CONN HDR 6POS 0.1 STACK SMD TIN
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 1
Number of Positions: 6
Length - Overall Pin: 0.415" (10.541mm)
Length - Post (Mating): 0.065" (1.651mm)
Length - Stack Height: 0.350" (8.890mm)
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| FTS-114-03-L-S |
Виробник: Samtec Inc.
Description: CONN HEADER VERT 14POS 1.27MM
Packaging: Tube
Connector Type: Header, Cuttable
Current Rating (Amps): 3.4A per Contact
Mounting Type: Through Hole
Number of Positions: 14
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.034" (0.86mm)
Shrouding: Unshrouded
Overall Contact Length: 0.189" (4.80mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.065" (1.65mm)
Description: CONN HEADER VERT 14POS 1.27MM
Packaging: Tube
Connector Type: Header, Cuttable
Current Rating (Amps): 3.4A per Contact
Mounting Type: Through Hole
Number of Positions: 14
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.034" (0.86mm)
Shrouding: Unshrouded
Overall Contact Length: 0.189" (4.80mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.065" (1.65mm)
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| FTS-114-03-L-SV |
Виробник: Samtec Inc.
Description: CONN HEADER SMD 14POS 1.27MM
Packaging: Tube
Connector Type: Header, Cuttable
Current Rating (Amps): 3.4A per Contact
Mounting Type: Surface Mount
Number of Positions: 14
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.034" (0.86mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.065" (1.65mm)
Description: CONN HEADER SMD 14POS 1.27MM
Packaging: Tube
Connector Type: Header, Cuttable
Current Rating (Amps): 3.4A per Contact
Mounting Type: Surface Mount
Number of Positions: 14
Number of Rows: 1
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.034" (0.86mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Contact Length - Mating: 0.065" (1.65mm)
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| TW-25-03-S-D-380-SM-A-P-TR |
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Виробник: Samtec Inc.
Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.467" (11.862mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.380" (9.652mm)
Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.467" (11.862mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.380" (9.652mm)
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