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Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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116-91-306-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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116-91-306-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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124-91-306-41-002000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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126-41-306-41-002000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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126-91-306-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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126-91-306-41-003000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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146-41-306-41-012000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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146-41-306-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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146-41-306-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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146-91-306-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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146-91-306-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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210-11-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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210-41-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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210-41-306-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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210-91-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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510-13-064-10-051001 | Mill-Max | IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET |
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510-13-064-10-051002 | Mill-Max | IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET |
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510-13-064-10-051003 | Mill-Max | IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET |
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510-83-100-13-064101 | Preci-Dip |
Description: CONN SOCKET PGA 100POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 100 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-100-13-064101 | Preci-dip | IC & Component Sockets |
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510-87-100-13-064101 | Preci-Dip |
Description: CONN SOCKET PGA 100POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 100 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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510-87-100-13-064101 | Preci-dip | IC & Component Sockets |
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511-13-064-10-051002 | Mill-Max | Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
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515-13-064-10-051001 | Mill-Max | IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET |
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515-13-064-10-051002 | Mill-Max | IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET |
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522-13-064-10-051001 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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522-13-064-10-051002 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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522-13-064-10-051003 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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523-13-064-10-051001 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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523-13-064-10-051002 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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523-13-064-10-051003 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
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609021306410000 | KYOCERA AVX |
Description: CONN RCPT HSG 6POS 2.54MM Packaging: Tray Connector Type: Receptacle Contact Termination: Crimp Color: Green Mounting Type: Free Hanging (In-Line) Number of Positions: 6 Pitch: 0.100" (2.54mm) Contact Type: Female Socket Fastening Type: Locking Ramp Insulation Material: Thermoplastic Number of Rows: 1 |
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612-11-306-41-001000 | Mill-Max | IC & Component Sockets STANDARD SOLDER TAIL CARRIER |
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612-41-306-41-001000 | Mill-Max | IC & Component Sockets STANDARD SOLDER TAIL CARRIER |
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612-41-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER SOLDRTL Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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612-41-306-41-003000 | Mill-Max | IC & Component Sockets STANDARD SOLDER TAIL CARRIER |
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612-41-306-41-004000 | Mill-Max | IC & Component Sockets STANDARD SOLDER TAIL CARRIER |
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612-91-306-41-001000 | Mill-Max | IC & Component Sockets STANDARD SOLDER TAIL CARRIER |
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612-91-306-41-004000 | Mill-Max | IC & Component Sockets STANDARD SOLDER TAIL CARRIER |
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614-13-064-10-051012 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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614-91-306-41-001000 | Mill-Max | IC & Component Sockets STANDARD RECEPTACLE CARRIER |
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801-13-064-10-007000 | Mill-Max | Headers & Wire Housings 64P,1R FML,20-18AWG 4.5A,SOLDERCUP STRIP |
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803-13-064-10-007000 | Mill-Max | Headers & Wire Housings 64P,2R FML,20-18AWG 4.5A,SOLDERCUP STRIP |
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853-13-064-10-003000 | Mill-Max | IC & Component Sockets STANDARD SOCKET HEADER |
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08055C104M4T4A | KYOCERA AVX |
Description: CAP CER 0.1UF 50V X7R 0805 Packaging: Tape & Reel (TR) Tolerance: ±20% Voltage - Rated: 50V Package / Case: 0805 (2012 Metric) Temperature Coefficient: X7R Size / Dimension: 0.079" L x 0.049" W (2.01mm x 1.25mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Automotive Ratings: AEC-Q200 Thickness (Max): 0.050" (1.27mm) Part Status: Active Capacitance: 0.1 µF |
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3064138 | Phoenix Contact | Fixed Terminal Blocks UT 2,5-MTD-DIO/L-RRD |
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929710-01-07 | 3M |
Description: CONN HEADER VERT 14POS 2.54MM Packaging: Bulk Connector Type: Header Current Rating (Amps): 2.5A Mounting Type: Through Hole Number of Positions: 14 Number of Rows: 2 Style: Board to Board Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Part Status: Active Contact Shape: Square Contact Length - Post: 0.110" (2.79mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.528" (13.42mm) Insulation Material: Polybutylene Terephthalate (PBT), Polyester, Glass Filled Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.318" (8.08mm) |
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ADS8324E/250 | Texas Instruments |
Description: IC ADC 14BIT SAR 8VSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Number of Bits: 14 Configuration: S/H-ADC Data Interface: SPI Reference Type: External Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.8V ~ 3.6V Voltage - Supply, Digital: 1.8V ~ 3.6V Sampling Rate (Per Second): 50k Input Type: Differential, Single Ended Number of Inputs: 1 Supplier Device Package: 8-VSSOP Architecture: SAR Ratio - S/H:ADC: 1:1 Part Status: Active Number of A/D Converters: 1 |
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ADS8324E/250 | Texas Instruments |
Description: IC ADC 14BIT SAR 8VSSOP Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Number of Bits: 14 Configuration: S/H-ADC Data Interface: SPI Reference Type: External Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.8V ~ 3.6V Voltage - Supply, Digital: 1.8V ~ 3.6V Sampling Rate (Per Second): 50k Input Type: Differential, Single Ended Number of Inputs: 1 Supplier Device Package: 8-VSSOP Architecture: SAR Ratio - S/H:ADC: 1:1 Part Status: Active Number of A/D Converters: 1 |
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CGA6P3X8R1E475M250AB | TDK Corporation |
Description: CAP CER 4.7UF 25V X8R 1210 Tolerance: ±20% Features: High Temperature Packaging: Tape & Reel (TR) Voltage - Rated: 25V Package / Case: 1210 (3225 Metric) Temperature Coefficient: X8R Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 150°C Applications: Automotive Ratings: AEC-Q200 Thickness (Max): 0.110" (2.80mm) Part Status: Active Capacitance: 4.7 µF |
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ESP32-WROOM-32-N4 | Espressif Systems |
Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Cut Tape (CT) Package / Case: 38-SMD Module Sensitivity: -98dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.5GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Power - Output: 20dBm Data Rate: 150Mbps RF Family/Standard: Bluetooth, WiFi Part Status: Not For New Designs DigiKey Programmable: Not Verified |
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ESP32-WROOM-32-N4 | Espressif Systems |
Description: RF TXRX MODULE BLUETOOTH SMD Packaging: Tape & Reel (TR) Package / Case: 38-SMD Module Sensitivity: -98dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.5GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Power - Output: 20dBm Data Rate: 150Mbps RF Family/Standard: Bluetooth, WiFi Part Status: Not For New Designs DigiKey Programmable: Not Verified |
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OKDL-T/6-W12-001-C | Murata Power Solutions Inc. |
Description: DC DC CONVERTER 0.6-5V Packaging: Tape & Reel (TR) Features: Remote On/Off, OCP, OTP, OVP, UVLO Package / Case: 32-BLGA Module Size / Dimension: 0.48" L x 0.48" W x 0.32" H (12.2mm x 12.2mm x 8.0mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module, Digital Operating Temperature: -40°C ~ 120°C Applications: ITE (Commercial) Voltage - Input (Max): 14V Efficiency: 95.6% Current - Output (Max): 6A Voltage - Input (Min): 4.5V Voltage - Output 1: 0.6 ~ 5V Control Features: Enable, Active High Part Status: Obsolete Number of Outputs: 1 |
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PLTU0603U3301LST5 | Vishay Dale Thin Film |
Description: RES SMD 3.3KOHM 0.01% 0.15W 0603 Packaging: Tape & Reel (TR) Power (Watts): 0.15W Tolerance: ±0.01% Features: Anti-Corrosive, Flame Proof, Moisture Resistant, Safety Package / Case: 0603 (1608 Metric) Temperature Coefficient: ±2ppm/°C Size / Dimension: 0.064" L x 0.032" W (1.63mm x 0.81mm) Composition: Thin Film Operating Temperature: -55°C ~ 125°C Number of Terminations: 2 Supplier Device Package: 0603 Height - Seated (Max): 0.020" (0.50mm) Part Status: Active Resistance: 3.3 kOhms |
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PLTU0603U3301LST5 | Vishay Dale Thin Film |
Description: RES SMD 3.3KOHM 0.01% 0.15W 0603 Power (Watts): 0.15W Tolerance: ±0.01% Features: Anti-Corrosive, Flame Proof, Moisture Resistant, Safety Packaging: Cut Tape (CT) Package / Case: 0603 (1608 Metric) Temperature Coefficient: ±2ppm/°C Size / Dimension: 0.064" L x 0.032" W (1.63mm x 0.81mm) Composition: Thin Film Operating Temperature: -55°C ~ 125°C Number of Terminations: 2 Supplier Device Package: 0603 Height - Seated (Max): 0.020" (0.50mm) Part Status: Active Resistance: 3.3 kOhms |
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GKS-113 302 180 A 1502 C | INGUN | GKS-113-0641 Contact Probes |
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116-91-306-41-007000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-306-41-008000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
124-91-306-41-002000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
126-41-306-41-002000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
126-91-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
126-91-306-41-003000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
146-41-306-41-012000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
146-41-306-41-012000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
146-41-306-41-013000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
146-91-306-41-012000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
146-91-306-41-013000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
210-11-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
210-41-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
210-41-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
210-91-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
510-13-064-10-051001 |
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
510-13-064-10-051002 |
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
510-13-064-10-051003 |
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
510-83-100-13-064101 |
Виробник: Preci-Dip
Description: CONN SOCKET PGA 100POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 100 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 100POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 100 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-87-100-13-064101 |
Виробник: Preci-Dip
Description: CONN SOCKET PGA 100POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 100 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 100POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 100 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
511-13-064-10-051002 |
Виробник: Mill-Max
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-13-064-10-051001 |
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-13-064-10-051002 |
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
522-13-064-10-051001 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-13-064-10-051002 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-13-064-10-051003 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
523-13-064-10-051001 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
523-13-064-10-051002 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
523-13-064-10-051003 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
609021306410000 |
Виробник: KYOCERA AVX
Description: CONN RCPT HSG 6POS 2.54MM
Packaging: Tray
Connector Type: Receptacle
Contact Termination: Crimp
Color: Green
Mounting Type: Free Hanging (In-Line)
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Contact Type: Female Socket
Fastening Type: Locking Ramp
Insulation Material: Thermoplastic
Number of Rows: 1
Description: CONN RCPT HSG 6POS 2.54MM
Packaging: Tray
Connector Type: Receptacle
Contact Termination: Crimp
Color: Green
Mounting Type: Free Hanging (In-Line)
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Contact Type: Female Socket
Fastening Type: Locking Ramp
Insulation Material: Thermoplastic
Number of Rows: 1
товар відсутній
612-11-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
товар відсутній
612-41-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
товар відсутній
612-41-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER SOLDRTL
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT CARRIER SOLDRTL
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
612-41-306-41-003000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
товар відсутній
612-41-306-41-004000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
товар відсутній
612-91-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
товар відсутній
612-91-306-41-004000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
IC & Component Sockets STANDARD SOLDER TAIL CARRIER
товар відсутній
614-13-064-10-051012 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
614-91-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
IC & Component Sockets STANDARD RECEPTACLE CARRIER
товар відсутній
801-13-064-10-007000 |
Виробник: Mill-Max
Headers & Wire Housings 64P,1R FML,20-18AWG 4.5A,SOLDERCUP STRIP
Headers & Wire Housings 64P,1R FML,20-18AWG 4.5A,SOLDERCUP STRIP
товар відсутній
803-13-064-10-007000 |
Виробник: Mill-Max
Headers & Wire Housings 64P,2R FML,20-18AWG 4.5A,SOLDERCUP STRIP
Headers & Wire Housings 64P,2R FML,20-18AWG 4.5A,SOLDERCUP STRIP
товар відсутній
853-13-064-10-003000 |
Виробник: Mill-Max
IC & Component Sockets STANDARD SOCKET HEADER
IC & Component Sockets STANDARD SOCKET HEADER
товар відсутній
08055C104M4T4A |
Виробник: KYOCERA AVX
Description: CAP CER 0.1UF 50V X7R 0805
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Voltage - Rated: 50V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.01mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.050" (1.27mm)
Part Status: Active
Capacitance: 0.1 µF
Description: CAP CER 0.1UF 50V X7R 0805
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Voltage - Rated: 50V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.01mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.050" (1.27mm)
Part Status: Active
Capacitance: 0.1 µF
товар відсутній
929710-01-07 |
Виробник: 3M
Description: CONN HEADER VERT 14POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2.5A
Mounting Type: Through Hole
Number of Positions: 14
Number of Rows: 2
Style: Board to Board
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.528" (13.42mm)
Insulation Material: Polybutylene Terephthalate (PBT), Polyester, Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Description: CONN HEADER VERT 14POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2.5A
Mounting Type: Through Hole
Number of Positions: 14
Number of Rows: 2
Style: Board to Board
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.528" (13.42mm)
Insulation Material: Polybutylene Terephthalate (PBT), Polyester, Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
товар відсутній
ADS8324E/250 |
Виробник: Texas Instruments
Description: IC ADC 14BIT SAR 8VSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.8V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.6V
Sampling Rate (Per Second): 50k
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 8-VSSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
Description: IC ADC 14BIT SAR 8VSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.8V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.6V
Sampling Rate (Per Second): 50k
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 8-VSSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
товар відсутній
ADS8324E/250 |
Виробник: Texas Instruments
Description: IC ADC 14BIT SAR 8VSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.8V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.6V
Sampling Rate (Per Second): 50k
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 8-VSSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
Description: IC ADC 14BIT SAR 8VSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.8V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.6V
Sampling Rate (Per Second): 50k
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 8-VSSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
товар відсутній
CGA6P3X8R1E475M250AB |
Виробник: TDK Corporation
Description: CAP CER 4.7UF 25V X8R 1210
Tolerance: ±20%
Features: High Temperature
Packaging: Tape & Reel (TR)
Voltage - Rated: 25V
Package / Case: 1210 (3225 Metric)
Temperature Coefficient: X8R
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 150°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.110" (2.80mm)
Part Status: Active
Capacitance: 4.7 µF
Description: CAP CER 4.7UF 25V X8R 1210
Tolerance: ±20%
Features: High Temperature
Packaging: Tape & Reel (TR)
Voltage - Rated: 25V
Package / Case: 1210 (3225 Metric)
Temperature Coefficient: X8R
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 150°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.110" (2.80mm)
Part Status: Active
Capacitance: 4.7 µF
товар відсутній
ESP32-WROOM-32-N4 |
Виробник: Espressif Systems
Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Cut Tape (CT)
Package / Case: 38-SMD Module
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 20dBm
Data Rate: 150Mbps
RF Family/Standard: Bluetooth, WiFi
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Cut Tape (CT)
Package / Case: 38-SMD Module
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 20dBm
Data Rate: 150Mbps
RF Family/Standard: Bluetooth, WiFi
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
товар відсутній
ESP32-WROOM-32-N4 |
Виробник: Espressif Systems
Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tape & Reel (TR)
Package / Case: 38-SMD Module
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 20dBm
Data Rate: 150Mbps
RF Family/Standard: Bluetooth, WiFi
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tape & Reel (TR)
Package / Case: 38-SMD Module
Sensitivity: -98dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Power - Output: 20dBm
Data Rate: 150Mbps
RF Family/Standard: Bluetooth, WiFi
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
товар відсутній
OKDL-T/6-W12-001-C |
Виробник: Murata Power Solutions Inc.
Description: DC DC CONVERTER 0.6-5V
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Package / Case: 32-BLGA Module
Size / Dimension: 0.48" L x 0.48" W x 0.32" H (12.2mm x 12.2mm x 8.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module, Digital
Operating Temperature: -40°C ~ 120°C
Applications: ITE (Commercial)
Voltage - Input (Max): 14V
Efficiency: 95.6%
Current - Output (Max): 6A
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.6 ~ 5V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
Description: DC DC CONVERTER 0.6-5V
Packaging: Tape & Reel (TR)
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Package / Case: 32-BLGA Module
Size / Dimension: 0.48" L x 0.48" W x 0.32" H (12.2mm x 12.2mm x 8.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module, Digital
Operating Temperature: -40°C ~ 120°C
Applications: ITE (Commercial)
Voltage - Input (Max): 14V
Efficiency: 95.6%
Current - Output (Max): 6A
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.6 ~ 5V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
товар відсутній
PLTU0603U3301LST5 |
Виробник: Vishay Dale Thin Film
Description: RES SMD 3.3KOHM 0.01% 0.15W 0603
Packaging: Tape & Reel (TR)
Power (Watts): 0.15W
Tolerance: ±0.01%
Features: Anti-Corrosive, Flame Proof, Moisture Resistant, Safety
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±2ppm/°C
Size / Dimension: 0.064" L x 0.032" W (1.63mm x 0.81mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 125°C
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.020" (0.50mm)
Part Status: Active
Resistance: 3.3 kOhms
Description: RES SMD 3.3KOHM 0.01% 0.15W 0603
Packaging: Tape & Reel (TR)
Power (Watts): 0.15W
Tolerance: ±0.01%
Features: Anti-Corrosive, Flame Proof, Moisture Resistant, Safety
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±2ppm/°C
Size / Dimension: 0.064" L x 0.032" W (1.63mm x 0.81mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 125°C
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.020" (0.50mm)
Part Status: Active
Resistance: 3.3 kOhms
товар відсутній
PLTU0603U3301LST5 |
Виробник: Vishay Dale Thin Film
Description: RES SMD 3.3KOHM 0.01% 0.15W 0603
Power (Watts): 0.15W
Tolerance: ±0.01%
Features: Anti-Corrosive, Flame Proof, Moisture Resistant, Safety
Packaging: Cut Tape (CT)
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±2ppm/°C
Size / Dimension: 0.064" L x 0.032" W (1.63mm x 0.81mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 125°C
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.020" (0.50mm)
Part Status: Active
Resistance: 3.3 kOhms
Description: RES SMD 3.3KOHM 0.01% 0.15W 0603
Power (Watts): 0.15W
Tolerance: ±0.01%
Features: Anti-Corrosive, Flame Proof, Moisture Resistant, Safety
Packaging: Cut Tape (CT)
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±2ppm/°C
Size / Dimension: 0.064" L x 0.032" W (1.63mm x 0.81mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 125°C
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.020" (0.50mm)
Part Status: Active
Resistance: 3.3 kOhms
товар відсутній
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