Виробник: Knitter-Switch
ICSI15322796SHMST12

Виробник: IQD Frequency Products
Crystal 11.997913MHz ±10ppm (Tol) ±10ppm (Stability) 12pF FUND 40Ohm 2-Pin HC-49/4H SMX SMD T/R

Виробник: Bourns
Inductor General Purpose Chip Wirewound 27uH 10% 2.52MHz 10Q-Factor Ferrite 0.33A 1.2Ohm DCR 1812 T/R

Виробник: Bourns
Inductor General Purpose Chip Wirewound 270uH 10% 796KHz 20Q-Factor Ferrite 0.1A 11Ohm DCR 1812 T/R

Виробник: Bourns
Inductor General Purpose Chip Wirewound 27uH 5% 2.52MHz 50Q-Factor Ferrite 0.17A 3.6Ohm DCR 1812 T/R

Виробник: Bourns
Inductor General Purpose Chip Wirewound 27uH 10% 2.52MHz 50Q-Factor Ferrite 0.17A 3.6Ohm DCR 1812 T/R

Виробник: Bourns
Inductor General Purpose Chip Wirewound 270uH 5% 796KHz 40Q-Factor Ferrite 0.092A 12Ohm DCR 1812 T/R

Виробник: Bourns
Inductor General Purpose Chip Wirewound 270uH 10% 796KHz 40Q-Factor Ferrite 0.092A 12Ohm DCR 1812 T/R

Виробник: Infineon Technologies
32-bit ARM Cortex M3 FM3 Microcontroller

Виробник: NXP Semiconductors
MCU 16-bit HCS12 CISC 128KB Flash 2.5V/5V Automotive 80-Pin PQFP Tray

Виробник: NXP Semiconductors
MCU 16-bit HCS12 CISC 32KB Flash 2.5V/5V Automotive 80-Pin PQFP Tray

Виробник: NXP Semiconductors
MCU 16-bit HCS12 CISC 32KB Flash 2.5V/5V Automotive 52-Pin LQFP Tray

Виробник: NXP Semiconductors
MPU ColdFire MPC5xxx Processor RISC 32bit 240MHz 256-Pin MAP-BGA Tray

Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
MCU 32-bit e200z6 RISC 2MB Flash 1.8V/2.5V/3.3V/5V Automotive 416-Pin BGA Tray

Виробник: NXP Semiconductors
MCU 32-bit e200z6 RISC 2MB Flash 1.8V/2.5V/3.3V/5V Automotive 416-Pin BGA Tray

Виробник: NXP Semiconductors
MCU 32-bit PowerPC RISC ROMLess 2.6V/5V Automotive 388-Pin BGA Tray

Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART

Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 350MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART

Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART

Виробник: NXP Semiconductors
MPU PowerQUICC II MPC82xx Processor RISC 32bit 0.13um 400MHz 3.3V 516-Pin TEBGA Tray

Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART

Виробник: NXP Semiconductors
MPU PowerQUICC II MPC82xx Processor RISC 32bit 0.13um 266MHz 3.3V 516-Pin TEBGA Tray

Виробник: NXP Semiconductors
MPU PowerPC MPC8xx Processor RISC 32bit 0.13um 400MHz 1.8V/2.5V/3.3V 620-Pin BGA Tray

Виробник: NXP Semiconductors
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 0.13um 400MHz 1.8V/2.5V/3.3V 620-Pin BGA Tray

Виробник: NXP Semiconductors
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 0.13um 400MHz 1.8V/2.5V/3.3V 668-Pin BGA Tray

Виробник: NXP Semiconductors
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.18um 50MHz 3.3V 357-Pin BGA Tray

Виробник: NXP Semiconductors
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.18um 133MHz 3.3V 256-Pin BGA Tray

Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Виробник: NXP Semiconductors
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.18um 80MHz 3.3V 357-Pin BGA Tray

Виробник: NXP Semiconductors
Pressure Sensor 0kPa to 200kPa Differential 4-Pin Case 344-15 Tray

Виробник: NXP Semiconductors
Pressure Sensor 0V to 0.04V 0kPa to 200kPa Differential 4-Pin Case 344C-01 Tray

Виробник: NXP Semiconductors
Board Mount Pressure Sensor 0.2V to 4.7V 0kPa to 10kPa Differential Automotive 6-Pin Case 867C-05 Tray

Виробник: NXP Semiconductors
Board Mount Pressure Sensor 0.2V to 4.7V 0kPa to 700kPa Differential Automotive 6-Pin Case 867-08 Tray

Виробник: NXP Semiconductors
Pressure Sensor 0kPa to 200kPa Differential 8-Pin SNSR T/R

Виробник: NXP Semiconductors
Pressure Sensor 0.2V to 4.8V 0kPa to 6kPa Gage 8-Pin SMT Tube

Виробник: NXP USA Inc.
Description: SENSOR 0.57PSIG 0.13" 4.9V
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Operating Temperature: 0°C ~ 85°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 2.32PSI (16kPa)
Part Status: Active

Виробник: NXP Semiconductors
Board Mount Pressure Sensor 0kPa to 3.92kPa Gage Automotive 8-Pin SOP T/R

Виробник: NXP Semiconductors
Board Mount Pressure Sensor 0.2V to 4.7V 0kPa to 10kPa Gage Automotive 8-Pin PDIP Tube

Виробник: NXP Semiconductors
Board Mount Pressure Sensor 0.2V to 4.7V 0kPa to 50kPa Gage 8-Pin SOP Tray

Виробник: NXP Semiconductors
Board Mount Pressure Sensor 0kPa to 100kPa Gage Automotive 8-Pin Case 482C-03 Tube

Виробник: NXP Semiconductors
Pressure Sensor 0.5V to 4.5V -2kPa to 2kPa Gage 8-Pin SMD Tube

Виробник: NXP Semiconductors
Trans RF MOSFET N-CH 65V 5-Pin TO-270 W T/R

Виробник: NXP Semiconductors
Trans RF FET N-CH 65V 3-Pin TO-270 T/R

Виробник: NXP Semiconductors
S12D 16-bit HCS12 core High Performance Microcontroller

Виробник: Pulse Electronics
Description: CONN SFP RCPT W/CAGE 2X6 240P RA
Features: EMI Shielded, Light Pipe
Packaging: Tray
Connector Type: SFP
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Number of Positions: 240 (20 x 12)
Termination: Press-Fit
Connector Style: Receptacle with Cage, Ganged (2x6)
Contact Finish Thickness: 30.0µin (0.76µm)

Виробник: NXP Semiconductors
32-bit MCU, Dual core, 6MB Flash, 160MHz, -40/+125degC

Виробник: Phoenix Contact
Connector Accessories EMC Shield Adapter Brass Nickel